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IC Packaging and Testing- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Industry: Packaging

Published: 2024-08-14

Pages: 199 Pages

Report ld: 3278917

Description
Table of Contents
Table of Figures
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Description
Table of Contents
Table of Figures
PDF Download

Description

The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing.

This report studies IC Packaging and Testing.

IC Packaging and Testing Market Size

M= millions and B=billions

According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.

The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.

The global market for IC Packaging and Testing was estimated to be worth US$ 76920 million in 2023 and is forecast to a readjusted size of US$ 108320 million by 2030 with a CAGR of 5.1% during the forecast period 2024-2030.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

The IC Packaging and Testing market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging and Testing.

Market Segmentation

Report Metric
Details
Report Title
IC Packaging and Testing- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Forecasted Market Size in 2030
US$ 108320 million
CAGR(2024-2030)
5.1%
Market Size Available for Years
2019-2030
Global IC Packaging and Testing Companies Covered
Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Western Digital, Infineon, NXP, Analog Devices, Inc. (ADI), Renesas, Microchip Technology, Onsemi, Sony Semiconductor Solutions Corporation, Panasonic, Winbond, Nanya Technology, ISSI (Integrated Silicon Solution Inc.), Macronix, Giantec Semiconductor, Sharp, Magnachip, Toshiba, JS Foundry KK., Hitachi, Murata, Skyworks Solutions Inc, Wolfspeed, Littelfuse, Diodes Incorporated, Rohm, Fuji Electric, Vishay Intertechnology, Mitsubishi Electric, Nexperia, Ampleon, CR Micro, Hangzhou Silan Integrated Circuit, ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Hefei Chipmore Technology Co.,Ltd., HT-tech, Chippacking
Global IC Packaging and Testing Market, by Region
North America (U.S., Canada, Mexico)

Europe (Germany, France, UK, Italy, etc.)

Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)

South America (Brazil, etc.)

Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global IC Packaging and Testing Market, Segment by Type
IC Packaging

IC Testing
Global IC Packaging and Testing Market, Segment by Application
OSAT

IDM
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of IC Packaging and Testing company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Business Model, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of IC Packaging and Testing in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of IC Packaging and Testing in country level. It provides sigmate data by Type, and by Business Model for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Table of Contents

 1 Market Overview
    1.1 IC Packaging and Testing Product Introduction
    1.2 Global IC Packaging and Testing Market Size Forecast (2019-2030)
    1.3 IC Packaging and Testing Market Trends & Drivers
        1.3.1 IC Packaging and Testing Industry Trends
        1.3.2 IC Packaging and Testing Market Drivers & Opportunity
        1.3.3 IC Packaging and Testing Market Challenges
        1.3.4 IC Packaging and Testing Market Restraints
    1.4 Assumptions and Limitations
    1.5 Study Objectives
    1.6 Years Considered

 2 Competitive Analysis by Company
    2.1 Global IC Packaging and Testing Players Revenue Ranking (2023)
    2.2 Global IC Packaging and Testing Revenue by Company (2019-2024)
    2.3 Key Companies IC Packaging and Testing Manufacturing Base Distribution and Headquarters
    2.4 Key Companies IC Packaging and Testing Product Offered
    2.5 Key Companies Time to Begin Mass Production of IC Packaging and Testing
    2.6 IC Packaging and Testing Market Competitive Analysis
        2.6.1 IC Packaging and Testing Market Concentration Rate (2019-2024)
        2.6.2 Global 5 and 10 Largest Companies by IC Packaging and Testing Revenue in 2023
        2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Packaging and Testing as of 2023)
    2.7 Mergers & Acquisitions, Expansion

 3 Segmentation by Type
    3.1 Introduction by Type
        3.1.1 IC Packaging
        3.1.2 IC Testing
    3.2 Global IC Packaging and Testing Sales Value by Type
        3.2.1 Global IC Packaging and Testing Sales Value by Type (2019 VS 2023 VS 2030)
        3.2.2 Global IC Packaging and Testing Sales Value, by Type (2019-2030)
        3.2.3 Global IC Packaging and Testing Sales Value, by Type (%) (2019-2030)

 4 Segmentation by Business Model
    4.1 Introduction by Business Model
        4.1.1 OSAT
        4.1.2 IDM
    4.2 Global IC Packaging and Testing Sales Value by Business Model
        4.2.1 Global IC Packaging and Testing Sales Value by Business Model (2019 VS 2023 VS 2030)
        4.2.2 Global IC Packaging and Testing Sales Value, by Business Model (2019-2030)
        4.2.3 Global IC Packaging and Testing Sales Value, by Business Model (%) (2019-2030)

 5 Segmentation by Region
    5.1 Global IC Packaging and Testing Sales Value by Region
        5.1.1 Global IC Packaging and Testing Sales Value by Region: 2019 VS 2023 VS 2030
        5.1.2 Global IC Packaging and Testing Sales Value by Region (2019-2024)
        5.1.3 Global IC Packaging and Testing Sales Value by Region (2025-2030)
        5.1.4 Global IC Packaging and Testing Sales Value by Region (%), (2019-2030)
    5.2 North America
        5.2.1 North America IC Packaging and Testing Sales Value, 2019-2030
        5.2.2 North America IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030
    5.3 Europe
        5.3.1 Europe IC Packaging and Testing Sales Value, 2019-2030
        5.3.2 Europe IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030
    5.4 Asia Pacific
        5.4.1 Asia Pacific IC Packaging and Testing Sales Value, 2019-2030
        5.4.2 Asia Pacific IC Packaging and Testing Sales Value by Region (%), 2023 VS 2030
    5.5 South America
        5.5.1 South America IC Packaging and Testing Sales Value, 2019-2030
        5.5.2 South America IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030
    5.6 Middle East & Africa
        5.6.1 Middle East & Africa IC Packaging and Testing Sales Value, 2019-2030
        5.6.2 Middle East & Africa IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030

 6 Segmentation by Key Countries/Regions
    6.1 Key Countries/Regions IC Packaging and Testing Sales Value Growth Trends, 2019 VS 2023 VS 2030
    6.2 Key Countries/Regions IC Packaging and Testing Sales Value, 2019-2030
    6.3 United States
        6.3.1 United States IC Packaging and Testing Sales Value, 2019-2030
        6.3.2 United States IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
        6.3.3 United States IC Packaging and Testing Sales Value by Business Model, 2023 VS 2030
    6.4 Europe
        6.4.1 Europe IC Packaging and Testing Sales Value, 2019-2030
        6.4.2 Europe IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
        6.4.3 Europe IC Packaging and Testing Sales Value by Business Model, 2023 VS 2030
    6.5 China
        6.5.1 China IC Packaging and Testing Sales Value, 2019-2030
        6.5.2 China IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
        6.5.3 China IC Packaging and Testing Sales Value by Business Model, 2023 VS 2030
    6.6 Japan
        6.6.1 Japan IC Packaging and Testing Sales Value, 2019-2030
        6.6.2 Japan IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
        6.6.3 Japan IC Packaging and Testing Sales Value by Business Model, 2023 VS 2030
    6.7 South Korea
        6.7.1 South Korea IC Packaging and Testing Sales Value, 2019-2030
        6.7.2 South Korea IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
        6.7.3 South Korea IC Packaging and Testing Sales Value by Business Model, 2023 VS 2030
    6.8 Southeast Asia
        6.8.1 Southeast Asia IC Packaging and Testing Sales Value, 2019-2030
        6.8.2 Southeast Asia IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
        6.8.3 Southeast Asia IC Packaging and Testing Sales Value by Business Model, 2023 VS 2030
    6.9 India
        6.9.1 India IC Packaging and Testing Sales Value, 2019-2030
        6.9.2 India IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
        6.9.3 India IC Packaging and Testing Sales Value by Business Model, 2023 VS 2030

 7 Company Profiles
    7.1 Samsung
        7.1.1 Samsung Profile
        7.1.2 Samsung Main Business
        7.1.3 Samsung IC Packaging and Testing Products, Services and Solutions
        7.1.4 Samsung IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.1.5 Samsung Recent Developments
    7.2 Intel
        7.2.1 Intel Profile
        7.2.2 Intel Main Business
        7.2.3 Intel IC Packaging and Testing Products, Services and Solutions
        7.2.4 Intel IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.2.5 Intel Recent Developments
    7.3 SK Hynix
        7.3.1 SK Hynix Profile
        7.3.2 SK Hynix Main Business
        7.3.3 SK Hynix IC Packaging and Testing Products, Services and Solutions
        7.3.4 SK Hynix IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.3.5 SK Hynix Recent Developments
    7.4 Micron Technology
        7.4.1 Micron Technology Profile
        7.4.2 Micron Technology Main Business
        7.4.3 Micron Technology IC Packaging and Testing Products, Services and Solutions
        7.4.4 Micron Technology IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.4.5 Micron Technology Recent Developments
    7.5 Texas Instruments (TI)
        7.5.1 Texas Instruments (TI) Profile
        7.5.2 Texas Instruments (TI) Main Business
        7.5.3 Texas Instruments (TI) IC Packaging and Testing Products, Services and Solutions
        7.5.4 Texas Instruments (TI) IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.5.5 Texas Instruments (TI) Recent Developments
    7.6 STMicroelectronics
        7.6.1 STMicroelectronics Profile
        7.6.2 STMicroelectronics Main Business
        7.6.3 STMicroelectronics IC Packaging and Testing Products, Services and Solutions
        7.6.4 STMicroelectronics IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.6.5 STMicroelectronics Recent Developments
    7.7 Kioxia
        7.7.1 Kioxia Profile
        7.7.2 Kioxia Main Business
        7.7.3 Kioxia IC Packaging and Testing Products, Services and Solutions
        7.7.4 Kioxia IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.7.5 Kioxia Recent Developments
    7.8 Western Digital
        7.8.1 Western Digital Profile
        7.8.2 Western Digital Main Business
        7.8.3 Western Digital IC Packaging and Testing Products, Services and Solutions
        7.8.4 Western Digital IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.8.5 Western Digital Recent Developments
    7.9 Infineon
        7.9.1 Infineon Profile
        7.9.2 Infineon Main Business
        7.9.3 Infineon IC Packaging and Testing Products, Services and Solutions
        7.9.4 Infineon IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.9.5 Infineon Recent Developments
    7.10 NXP
        7.10.1 NXP Profile
        7.10.2 NXP Main Business
        7.10.3 NXP IC Packaging and Testing Products, Services and Solutions
        7.10.4 NXP IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.10.5 NXP Recent Developments
    7.11 Analog Devices, Inc. (ADI)
        7.11.1 Analog Devices, Inc. (ADI) Profile
        7.11.2 Analog Devices, Inc. (ADI) Main Business
        7.11.3 Analog Devices, Inc. (ADI) IC Packaging and Testing Products, Services and Solutions
        7.11.4 Analog Devices, Inc. (ADI) IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.11.5 Analog Devices, Inc. (ADI) Recent Developments
    7.12 Renesas
        7.12.1 Renesas Profile
        7.12.2 Renesas Main Business
        7.12.3 Renesas IC Packaging and Testing Products, Services and Solutions
        7.12.4 Renesas IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.12.5 Renesas Recent Developments
    7.13 Microchip Technology
        7.13.1 Microchip Technology Profile
        7.13.2 Microchip Technology Main Business
        7.13.3 Microchip Technology IC Packaging and Testing Products, Services and Solutions
        7.13.4 Microchip Technology IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.13.5 Microchip Technology Recent Developments
    7.14 Onsemi
        7.14.1 Onsemi Profile
        7.14.2 Onsemi Main Business
        7.14.3 Onsemi IC Packaging and Testing Products, Services and Solutions
        7.14.4 Onsemi IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.14.5 Onsemi Recent Developments
    7.15 Sony Semiconductor Solutions Corporation
        7.15.1 Sony Semiconductor Solutions Corporation Profile
        7.15.2 Sony Semiconductor Solutions Corporation Main Business
        7.15.3 Sony Semiconductor Solutions Corporation IC Packaging and Testing Products, Services and Solutions
        7.15.4 Sony Semiconductor Solutions Corporation IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.15.5 Sony Semiconductor Solutions Corporation Recent Developments
    7.16 Panasonic
        7.16.1 Panasonic Profile
        7.16.2 Panasonic Main Business
        7.16.3 Panasonic IC Packaging and Testing Products, Services and Solutions
        7.16.4 Panasonic IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.16.5 Panasonic Recent Developments
    7.17 Winbond
        7.17.1 Winbond Profile
        7.17.2 Winbond Main Business
        7.17.3 Winbond IC Packaging and Testing Products, Services and Solutions
        7.17.4 Winbond IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.17.5 Winbond Recent Developments
    7.18 Nanya Technology
        7.18.1 Nanya Technology Profile
        7.18.2 Nanya Technology Main Business
        7.18.3 Nanya Technology IC Packaging and Testing Products, Services and Solutions
        7.18.4 Nanya Technology IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.18.5 Nanya Technology Recent Developments
    7.19 ISSI (Integrated Silicon Solution Inc.)
        7.19.1 ISSI (Integrated Silicon Solution Inc.) Profile
        7.19.2 ISSI (Integrated Silicon Solution Inc.) Main Business
        7.19.3 ISSI (Integrated Silicon Solution Inc.) IC Packaging and Testing Products, Services and Solutions
        7.19.4 ISSI (Integrated Silicon Solution Inc.) IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.19.5 ISSI (Integrated Silicon Solution Inc.) Recent Developments
    7.20 Macronix
        7.20.1 Macronix Profile
        7.20.2 Macronix Main Business
        7.20.3 Macronix IC Packaging and Testing Products, Services and Solutions
        7.20.4 Macronix IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.20.5 Macronix Recent Developments
    7.21 Giantec Semiconductor
        7.21.1 Giantec Semiconductor Profile
        7.21.2 Giantec Semiconductor Main Business
        7.21.3 Giantec Semiconductor IC Packaging and Testing Products, Services and Solutions
        7.21.4 Giantec Semiconductor IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.21.5 Giantec Semiconductor Recent Developments
    7.22 Sharp
        7.22.1 Sharp Profile
        7.22.2 Sharp Main Business
        7.22.3 Sharp IC Packaging and Testing Products, Services and Solutions
        7.22.4 Sharp IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.22.5 Sharp Recent Developments
    7.23 Magnachip
        7.23.1 Magnachip Profile
        7.23.2 Magnachip Main Business
        7.23.3 Magnachip IC Packaging and Testing Products, Services and Solutions
        7.23.4 Magnachip IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.23.5 Magnachip Recent Developments
    7.24 Toshiba
        7.24.1 Toshiba Profile
        7.24.2 Toshiba Main Business
        7.24.3 Toshiba IC Packaging and Testing Products, Services and Solutions
        7.24.4 Toshiba IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.24.5 Toshiba Recent Developments
    7.25 JS Foundry KK.
        7.25.1 JS Foundry KK. Profile
        7.25.2 JS Foundry KK. Main Business
        7.25.3 JS Foundry KK. IC Packaging and Testing Products, Services and Solutions
        7.25.4 JS Foundry KK. IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.25.5 JS Foundry KK. Recent Developments
    7.26 Hitachi
        7.26.1 Hitachi Profile
        7.26.2 Hitachi Main Business
        7.26.3 Hitachi IC Packaging and Testing Products, Services and Solutions
        7.26.4 Hitachi IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.26.5 Hitachi Recent Developments
    7.27 Murata
        7.27.1 Murata Profile
        7.27.2 Murata Main Business
        7.27.3 Murata IC Packaging and Testing Products, Services and Solutions
        7.27.4 Murata IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.27.5 Murata Recent Developments
    7.28 Skyworks Solutions Inc
        7.28.1 Skyworks Solutions Inc Profile
        7.28.2 Skyworks Solutions Inc Main Business
        7.28.3 Skyworks Solutions Inc IC Packaging and Testing Products, Services and Solutions
        7.28.4 Skyworks Solutions Inc IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.28.5 Skyworks Solutions Inc Recent Developments
    7.29 Wolfspeed
        7.29.1 Wolfspeed Profile
        7.29.2 Wolfspeed Main Business
        7.29.3 Wolfspeed IC Packaging and Testing Products, Services and Solutions
        7.29.4 Wolfspeed IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.29.5 Wolfspeed Recent Developments
    7.30 Littelfuse
        7.30.1 Littelfuse Profile
        7.30.2 Littelfuse Main Business
        7.30.3 Littelfuse IC Packaging and Testing Products, Services and Solutions
        7.30.4 Littelfuse IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.30.5 Littelfuse Recent Developments
    7.31 Diodes Incorporated
        7.31.1 Diodes Incorporated Profile
        7.31.2 Diodes Incorporated Main Business
        7.31.3 Diodes Incorporated IC Packaging and Testing Products, Services and Solutions
        7.31.4 Diodes Incorporated IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.31.5 Diodes Incorporated Recent Developments
    7.32 Rohm
        7.32.1 Rohm Profile
        7.32.2 Rohm Main Business
        7.32.3 Rohm IC Packaging and Testing Products, Services and Solutions
        7.32.4 Rohm IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.32.5 Rohm Recent Developments
    7.33 Fuji Electric
        7.33.1 Fuji Electric Profile
        7.33.2 Fuji Electric Main Business
        7.33.3 Fuji Electric IC Packaging and Testing Products, Services and Solutions
        7.33.4 Fuji Electric IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.33.5 Fuji Electric Recent Developments
    7.34 Vishay Intertechnology
        7.34.1 Vishay Intertechnology Profile
        7.34.2 Vishay Intertechnology Main Business
        7.34.3 Vishay Intertechnology IC Packaging and Testing Products, Services and Solutions
        7.34.4 Vishay Intertechnology IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.34.5 Vishay Intertechnology Recent Developments
    7.35 Mitsubishi Electric
        7.35.1 Mitsubishi Electric Profile
        7.35.2 Mitsubishi Electric Main Business
        7.35.3 Mitsubishi Electric IC Packaging and Testing Products, Services and Solutions
        7.35.4 Mitsubishi Electric IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.35.5 Mitsubishi Electric Recent Developments
    7.36 Nexperia
        7.36.1 Nexperia Profile
        7.36.2 Nexperia Main Business
        7.36.3 Nexperia IC Packaging and Testing Products, Services and Solutions
        7.36.4 Nexperia IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.36.5 Nexperia Recent Developments
    7.37 Ampleon
        7.37.1 Ampleon Profile
        7.37.2 Ampleon Main Business
        7.37.3 Ampleon IC Packaging and Testing Products, Services and Solutions
        7.37.4 Ampleon IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.37.5 Ampleon Recent Developments
    7.38 CR Micro
        7.38.1 CR Micro Profile
        7.38.2 CR Micro Main Business
        7.38.3 CR Micro IC Packaging and Testing Products, Services and Solutions
        7.38.4 CR Micro IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.38.5 CR Micro Recent Developments
    7.39 Hangzhou Silan Integrated Circuit
        7.39.1 Hangzhou Silan Integrated Circuit Profile
        7.39.2 Hangzhou Silan Integrated Circuit Main Business
        7.39.3 Hangzhou Silan Integrated Circuit IC Packaging and Testing Products, Services and Solutions
        7.39.4 Hangzhou Silan Integrated Circuit IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.39.5 Hangzhou Silan Integrated Circuit Recent Developments
    7.40 ASE (SPIL)
        7.40.1 ASE (SPIL) Profile
        7.40.2 ASE (SPIL) Main Business
        7.40.3 ASE (SPIL) IC Packaging and Testing Products, Services and Solutions
        7.40.4 ASE (SPIL) IC Packaging and Testing Revenue (US$ Million) & (2019-2024)
        7.40.5 ASE (SPIL) Recent Developments

 8 Industry Chain Analysis
    8.1 IC Packaging and Testing Industrial Chain
    8.2 IC Packaging and Testing Upstream Analysis
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
        8.2.3 Manufacturing Cost Structure
    8.3 Midstream Analysis
    8.4 Downstream Analysis (Customers Analysis)
    8.5 Sales Model and Sales Channels
        8.5.1 IC Packaging and Testing Sales Model
        8.5.2 Sales Channel
        8.5.3 IC Packaging and Testing Distributors

 9 Research Findings and Conclusion

 10 Appendix
    10.1 Research Methodology
        10.1.1 Methodology/Research Approach
            10.1.1.1 Research Programs/Design
            10.1.1.2 Market Size Estimation
            10.1.1.3 Market Breakdown and Data Triangulation
        10.1.2 Data Source
            10.1.2.1 Secondary Sources
            10.1.2.2 Primary Sources
    10.2 Author Details
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. IC Packaging and Testing Market Trends
 Table 2. IC Packaging and Testing Market Drivers & Opportunity
 Table 3. IC Packaging and Testing Market Challenges
 Table 4. IC Packaging and Testing Market Restraints
 Table 5. Global IC Packaging and Testing Revenue by Company (2019-2024) & (US$ Million)
 Table 6. Global IC Packaging and Testing Revenue Market Share by Company (2019-2024)
 Table 7. Key Companies IC Packaging and Testing Manufacturing Base Distribution and Headquarters
 Table 8. Key Companies IC Packaging and Testing Product Type
 Table 9. Key Companies Time to Begin Mass Production of IC Packaging and Testing
 Table 10. Global IC Packaging and Testing Companies Market Concentration Ratio (CR5 and HHI)
 Table 11. Global Top Companies Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Packaging and Testing as of 2023)
 Table 12. Mergers & Acquisitions, Expansion Plans
 Table 13. Global IC Packaging and Testing Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
 Table 14. Global IC Packaging and Testing Sales Value by Type (2019-2024) & (US$ Million)
 Table 15. Global IC Packaging and Testing Sales Value by Type (2025-2030) & (US$ Million)
 Table 16. Global IC Packaging and Testing Sales Market Share in Value by Type (2019-2024)
 Table 17. Global IC Packaging and Testing Sales Market Share in Value by Type (2025-2030)
 Table 18. Global IC Packaging and Testing Sales Value by Business Model: 2019 VS 2023 VS 2030 (US$ Million)
 Table 19. Global IC Packaging and Testing Sales Value by Business Model (2019-2024) & (US$ Million)
 Table 20. Global IC Packaging and Testing Sales Value by Business Model (2025-2030) & (US$ Million)
 Table 21. Global IC Packaging and Testing Sales Market Share in Value by Business Model (2019-2024)
 Table 22. Global IC Packaging and Testing Sales Market Share in Value by Business Model (2025-2030)
 Table 23. Global IC Packaging and Testing Sales Value by Region, (2019 VS 2023 VS 2030) & (US$ Million)
 Table 24. Global IC Packaging and Testing Sales Value by Region (2019-2024) & (US$ Million)
 Table 25. Global IC Packaging and Testing Sales Value by Region (2025-2030) & (US$ Million)
 Table 26. Global IC Packaging and Testing Sales Value by Region (2019-2024) & (%)
 Table 27. Global IC Packaging and Testing Sales Value by Region (2025-2030) & (%)
 Table 28. Key Countries/Regions IC Packaging and Testing Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
 Table 29. Key Countries/Regions IC Packaging and Testing Sales Value, (2019-2024) & (US$ Million)
 Table 30. Key Countries/Regions IC Packaging and Testing Sales Value, (2025-2030) & (US$ Million)
 Table 31. Samsung Basic Information List
 Table 32. Samsung Description and Business Overview
 Table 33. Samsung IC Packaging and Testing Products, Services and Solutions
 Table 34. Revenue (US$ Million) in IC Packaging and Testing Business of Samsung (2019-2024)
 Table 35. Samsung Recent Developments
 Table 36. Intel Basic Information List
 Table 37. Intel Description and Business Overview
 Table 38. Intel IC Packaging and Testing Products, Services and Solutions
 Table 39. Revenue (US$ Million) in IC Packaging and Testing Business of Intel (2019-2024)
 Table 40. Intel Recent Developments
 Table 41. SK Hynix Basic Information List
 Table 42. SK Hynix Description and Business Overview
 Table 43. SK Hynix IC Packaging and Testing Products, Services and Solutions
 Table 44. Revenue (US$ Million) in IC Packaging and Testing Business of SK Hynix (2019-2024)
 Table 45. SK Hynix Recent Developments
 Table 46. Micron Technology Basic Information List
 Table 47. Micron Technology Description and Business Overview
 Table 48. Micron Technology IC Packaging and Testing Products, Services and Solutions
 Table 49. Revenue (US$ Million) in IC Packaging and Testing Business of Micron Technology (2019-2024)
 Table 50. Micron Technology Recent Developments
 Table 51. Texas Instruments (TI) Basic Information List
 Table 52. Texas Instruments (TI) Description and Business Overview
 Table 53. Texas Instruments (TI) IC Packaging and Testing Products, Services and Solutions
 Table 54. Revenue (US$ Million) in IC Packaging and Testing Business of Texas Instruments (TI) (2019-2024)
 Table 55. Texas Instruments (TI) Recent Developments
 Table 56. STMicroelectronics Basic Information List
 Table 57. STMicroelectronics Description and Business Overview
 Table 58. STMicroelectronics IC Packaging and Testing Products, Services and Solutions
 Table 59. Revenue (US$ Million) in IC Packaging and Testing Business of STMicroelectronics (2019-2024)
 Table 60. STMicroelectronics Recent Developments
 Table 61. Kioxia Basic Information List
 Table 62. Kioxia Description and Business Overview
 Table 63. Kioxia IC Packaging and Testing Products, Services and Solutions
 Table 64. Revenue (US$ Million) in IC Packaging and Testing Business of Kioxia (2019-2024)
 Table 65. Kioxia Recent Developments
 Table 66. Western Digital Basic Information List
 Table 67. Western Digital Description and Business Overview
 Table 68. Western Digital IC Packaging and Testing Products, Services and Solutions
 Table 69. Revenue (US$ Million) in IC Packaging and Testing Business of Western Digital (2019-2024)
 Table 70. Western Digital Recent Developments
 Table 71. Infineon Basic Information List
 Table 72. Infineon Description and Business Overview
 Table 73. Infineon IC Packaging and Testing Products, Services and Solutions
 Table 74. Revenue (US$ Million) in IC Packaging and Testing Business of Infineon (2019-2024)
 Table 75. Infineon Recent Developments
 Table 76. NXP Basic Information List
 Table 77. NXP Description and Business Overview
 Table 78. NXP IC Packaging and Testing Products, Services and Solutions
 Table 79. Revenue (US$ Million) in IC Packaging and Testing Business of NXP (2019-2024)
 Table 80. NXP Recent Developments
 Table 81. Analog Devices, Inc. (ADI) Basic Information List
 Table 82. Analog Devices, Inc. (ADI) Description and Business Overview
 Table 83. Analog Devices, Inc. (ADI) IC Packaging and Testing Products, Services and Solutions
 Table 84. Revenue (US$ Million) in IC Packaging and Testing Business of Analog Devices, Inc. (ADI) (2019-2024)
 Table 85. Analog Devices, Inc. (ADI) Recent Developments
 Table 86. Renesas Basic Information List
 Table 87. Renesas Description and Business Overview
 Table 88. Renesas IC Packaging and Testing Products, Services and Solutions
 Table 89. Revenue (US$ Million) in IC Packaging and Testing Business of Renesas (2019-2024)
 Table 90. Renesas Recent Developments
 Table 91. Microchip Technology Basic Information List
 Table 92. Microchip Technology Description and Business Overview
 Table 93. Microchip Technology IC Packaging and Testing Products, Services and Solutions
 Table 94. Revenue (US$ Million) in IC Packaging and Testing Business of Microchip Technology (2019-2024)
 Table 95. Microchip Technology Recent Developments
 Table 96. Onsemi Basic Information List
 Table 97. Onsemi Description and Business Overview
 Table 98. Onsemi IC Packaging and Testing Products, Services and Solutions
 Table 99. Revenue (US$ Million) in IC Packaging and Testing Business of Onsemi (2019-2024)
 Table 100. Onsemi Recent Developments
 Table 101. Sony Semiconductor Solutions Corporation Basic Information List
 Table 102. Sony Semiconductor Solutions Corporation Description and Business Overview
 Table 103. Sony Semiconductor Solutions Corporation IC Packaging and Testing Products, Services and Solutions
 Table 104. Revenue (US$ Million) in IC Packaging and Testing Business of Sony Semiconductor Solutions Corporation (2019-2024)
 Table 105. Sony Semiconductor Solutions Corporation Recent Developments
 Table 106. Panasonic Basic Information List
 Table 107. Panasonic Description and Business Overview
 Table 108. Panasonic IC Packaging and Testing Products, Services and Solutions
 Table 109. Revenue (US$ Million) in IC Packaging and Testing Business of Panasonic (2019-2024)
 Table 110. Panasonic Recent Developments
 Table 111. Winbond Basic Information List
 Table 112. Winbond Description and Business Overview
 Table 113. Winbond IC Packaging and Testing Products, Services and Solutions
 Table 114. Revenue (US$ Million) in IC Packaging and Testing Business of Winbond (2019-2024)
 Table 115. Winbond Recent Developments
 Table 116. Nanya Technology Basic Information List
 Table 117. Nanya Technology Description and Business Overview
 Table 118. Nanya Technology IC Packaging and Testing Products, Services and Solutions
 Table 119. Revenue (US$ Million) in IC Packaging and Testing Business of Nanya Technology (2019-2024)
 Table 120. Nanya Technology Recent Developments
 Table 121. ISSI (Integrated Silicon Solution Inc.) Basic Information List
 Table 122. ISSI (Integrated Silicon Solution Inc.) Description and Business Overview
 Table 123. ISSI (Integrated Silicon Solution Inc.) IC Packaging and Testing Products, Services and Solutions
 Table 124. Revenue (US$ Million) in IC Packaging and Testing Business of ISSI (Integrated Silicon Solution Inc.) (2019-2024)
 Table 125. ISSI (Integrated Silicon Solution Inc.) Recent Developments
 Table 126. Macronix Basic Information List
 Table 127. Macronix Description and Business Overview
 Table 128. Macronix IC Packaging and Testing Products, Services and Solutions
 Table 129. Revenue (US$ Million) in IC Packaging and Testing Business of Macronix (2019-2024)
 Table 130. Macronix Recent Developments
 Table 131. Giantec Semiconductor Basic Information List
 Table 132. Giantec Semiconductor Description and Business Overview
 Table 133. Giantec Semiconductor IC Packaging and Testing Products, Services and Solutions
 Table 134. Revenue (US$ Million) in IC Packaging and Testing Business of Giantec Semiconductor (2019-2024)
 Table 135. Giantec Semiconductor Recent Developments
 Table 136. Sharp Basic Information List
 Table 137. Sharp Description and Business Overview
 Table 138. Sharp IC Packaging and Testing Products, Services and Solutions
 Table 139. Revenue (US$ Million) in IC Packaging and Testing Business of Sharp (2019-2024)
 Table 140. Sharp Recent Developments
 Table 141. Magnachip Basic Information List
 Table 142. Magnachip Description and Business Overview
 Table 143. Magnachip IC Packaging and Testing Products, Services and Solutions
 Table 144. Revenue (US$ Million) in IC Packaging and Testing Business of Magnachip (2019-2024)
 Table 145. Magnachip Recent Developments
 Table 146. Toshiba Basic Information List
 Table 147. Toshiba Description and Business Overview
 Table 148. Toshiba IC Packaging and Testing Products, Services and Solutions
 Table 149. Revenue (US$ Million) in IC Packaging and Testing Business of Toshiba (2019-2024)
 Table 150. Toshiba Recent Developments
 Table 151. JS Foundry KK. Basic Information List
 Table 152. JS Foundry KK. Description and Business Overview
 Table 153. JS Foundry KK. IC Packaging and Testing Products, Services and Solutions
 Table 154. Revenue (US$ Million) in IC Packaging and Testing Business of JS Foundry KK. (2019-2024)
 Table 155. JS Foundry KK. Recent Developments
 Table 156. Hitachi Basic Information List
 Table 157. Hitachi Description and Business Overview
 Table 158. Hitachi IC Packaging and Testing Products, Services and Solutions
 Table 159. Revenue (US$ Million) in IC Packaging and Testing Business of Hitachi (2019-2024)
 Table 160. Hitachi Recent Developments
 Table 161. Murata Basic Information List
 Table 162. Murata Description and Business Overview
 Table 163. Murata IC Packaging and Testing Products, Services and Solutions
 Table 164. Revenue (US$ Million) in IC Packaging and Testing Business of Murata (2019-2024)
 Table 165. Murata Recent Developments
 Table 166. Skyworks Solutions Inc Basic Information List
 Table 167. Skyworks Solutions Inc Description and Business Overview
 Table 168. Skyworks Solutions Inc IC Packaging and Testing Products, Services and Solutions
 Table 169. Revenue (US$ Million) in IC Packaging and Testing Business of Skyworks Solutions Inc (2019-2024)
 Table 170. Skyworks Solutions Inc Recent Developments
 Table 171. Wolfspeed Basic Information List
 Table 172. Wolfspeed Description and Business Overview
 Table 173. Wolfspeed IC Packaging and Testing Products, Services and Solutions
 Table 174. Revenue (US$ Million) in IC Packaging and Testing Business of Wolfspeed (2019-2024)
 Table 175. Wolfspeed Recent Developments
 Table 176. Littelfuse Basic Information List
 Table 177. Littelfuse Description and Business Overview
 Table 178. Littelfuse IC Packaging and Testing Products, Services and Solutions
 Table 179. Revenue (US$ Million) in IC Packaging and Testing Business of Littelfuse (2019-2024)
 Table 180. Littelfuse Recent Developments
 Table 181. Diodes Incorporated Basic Information List
 Table 182. Diodes Incorporated Description and Business Overview
 Table 183. Diodes Incorporated IC Packaging and Testing Products, Services and Solutions
 Table 184. Revenue (US$ Million) in IC Packaging and Testing Business of Diodes Incorporated (2019-2024)
 Table 185. Diodes Incorporated Recent Developments
 Table 186. Rohm Basic Information List
 Table 187. Rohm Description and Business Overview
 Table 188. Rohm IC Packaging and Testing Products, Services and Solutions
 Table 189. Revenue (US$ Million) in IC Packaging and Testing Business of Rohm (2019-2024)
 Table 190. Rohm Recent Developments
 Table 191. Fuji Electric Basic Information List
 Table 192. Fuji Electric Description and Business Overview
 Table 193. Fuji Electric IC Packaging and Testing Products, Services and Solutions
 Table 194. Revenue (US$ Million) in IC Packaging and Testing Business of Fuji Electric (2019-2024)
 Table 195. Fuji Electric Recent Developments
 Table 196. Vishay Intertechnology Basic Information List
 Table 197. Vishay Intertechnology Description and Business Overview
 Table 198. Vishay Intertechnology IC Packaging and Testing Products, Services and Solutions
 Table 199. Revenue (US$ Million) in IC Packaging and Testing Business of Vishay Intertechnology (2019-2024)
 Table 200. Vishay Intertechnology Recent Developments
 Table 201. Mitsubishi Electric Basic Information List
 Table 202. Mitsubishi Electric Description and Business Overview
 Table 203. Mitsubishi Electric IC Packaging and Testing Products, Services and Solutions
 Table 204. Revenue (US$ Million) in IC Packaging and Testing Business of Mitsubishi Electric (2019-2024)
 Table 205. Mitsubishi Electric Recent Developments
 Table 206. Nexperia Basic Information List
 Table 207. Nexperia Description and Business Overview
 Table 208. Nexperia IC Packaging and Testing Products, Services and Solutions
 Table 209. Revenue (US$ Million) in IC Packaging and Testing Business of Nexperia (2019-2024)
 Table 210. Nexperia Recent Developments
 Table 211. Ampleon Basic Information List
 Table 212. Ampleon Description and Business Overview
 Table 213. Ampleon IC Packaging and Testing Products, Services and Solutions
 Table 214. Revenue (US$ Million) in IC Packaging and Testing Business of Ampleon (2019-2024)
 Table 215. Ampleon Recent Developments
 Table 216. CR Micro Basic Information List
 Table 217. CR Micro Description and Business Overview
 Table 218. CR Micro IC Packaging and Testing Products, Services and Solutions
 Table 219. Revenue (US$ Million) in IC Packaging and Testing Business of CR Micro (2019-2024)
 Table 220. CR Micro Recent Developments
 Table 221. Hangzhou Silan Integrated Circuit Basic Information List
 Table 222. Hangzhou Silan Integrated Circuit Description and Business Overview
 Table 223. Hangzhou Silan Integrated Circuit IC Packaging and Testing Products, Services and Solutions
 Table 224. Revenue (US$ Million) in IC Packaging and Testing Business of Hangzhou Silan Integrated Circuit (2019-2024)
 Table 225. Hangzhou Silan Integrated Circuit Recent Developments
 Table 226. ASE (SPIL) Basic Information List
 Table 227. ASE (SPIL) Description and Business Overview
 Table 228. ASE (SPIL) IC Packaging and Testing Products, Services and Solutions
 Table 229. Revenue (US$ Million) in IC Packaging and Testing Business of ASE (SPIL) (2019-2024)
 Table 230. ASE (SPIL) Recent Developments
 Table 231. Key Raw Materials Lists
 Table 232. Raw Materials Key Suppliers Lists
 Table 233. IC Packaging and Testing Downstream Customers
 Table 234. IC Packaging and Testing Distributors List
 Table 235. Research Programs/Design for This Report
 Table 236. Key Data Information from Secondary Sources
 Table 237. Key Data Information from Primary Sources
 Table 238. Business Unit and Senior & Team Lead Analysts


List of Figures
 Figure 1. IC Packaging and Testing Product Picture
 Figure 2. Global IC Packaging and Testing Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
 Figure 3. Global IC Packaging and Testing Sales Value (2019-2030) & (US$ Million)
 Figure 4. IC Packaging and Testing Report Years Considered
 Figure 5. Global IC Packaging and Testing Players Revenue Ranking (2023) & (US$ Million)
 Figure 6. The 5 and 10 Largest Companies in the World: Market Share by IC Packaging and Testing Revenue in 2023
 Figure 7. IC Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
 Figure 8. IC Packaging Picture
 Figure 9. IC Testing Picture
 Figure 10. Global IC Packaging and Testing Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
 Figure 11. Global IC Packaging and Testing Sales Value Market Share by Type, 2023 & 2030
 Figure 12. Product Picture of OSAT
 Figure 13. Product Picture of IDM
 Figure 14. Global IC Packaging and Testing Sales Value by Business Model (2019 VS 2023 VS 2030) & (US$ Million)
 Figure 15. Global IC Packaging and Testing Sales Value Market Share by Business Model, 2023 & 2030
 Figure 16. North America IC Packaging and Testing Sales Value (2019-2030) & (US$ Million)
 Figure 17. North America IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030
 Figure 18. Europe IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 19. Europe IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030
 Figure 20. Asia Pacific IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 21. Asia Pacific IC Packaging and Testing Sales Value by Region (%), 2023 VS 2030
 Figure 22. South America IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 23. South America IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030
 Figure 24. Middle East & Africa IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 25. Middle East & Africa IC Packaging and Testing Sales Value by Country (%), 2023 VS 2030
 Figure 26. Key Countries/Regions IC Packaging and Testing Sales Value (%), (2019-2030)
 Figure 27. United States IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 28. United States IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
 Figure 29. United States IC Packaging and Testing Sales Value by Business Model (%), 2023 VS 2030
 Figure 30. Europe IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 31. Europe IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
 Figure 32. Europe IC Packaging and Testing Sales Value by Business Model (%), 2023 VS 2030
 Figure 33. China IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 34. China IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
 Figure 35. China IC Packaging and Testing Sales Value by Business Model (%), 2023 VS 2030
 Figure 36. Japan IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 37. Japan IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
 Figure 38. Japan IC Packaging and Testing Sales Value by Business Model (%), 2023 VS 2030
 Figure 39. South Korea IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 40. South Korea IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
 Figure 41. South Korea IC Packaging and Testing Sales Value by Business Model (%), 2023 VS 2030
 Figure 42. Southeast Asia IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 43. Southeast Asia IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
 Figure 44. Southeast Asia IC Packaging and Testing Sales Value by Business Model (%), 2023 VS 2030
 Figure 45. India IC Packaging and Testing Sales Value, (2019-2030) & (US$ Million)
 Figure 46. India IC Packaging and Testing Sales Value by Type (%), 2023 VS 2030
 Figure 47. India IC Packaging and Testing Sales Value by Business Model (%), 2023 VS 2030
 Figure 48. IC Packaging and Testing Industrial Chain
 Figure 49. IC Packaging and Testing Manufacturing Cost Structure
 Figure 50. Channels of Distribution (Direct Sales, and Distribution)
 Figure 51. Bottom-up and Top-down Approaches for This Report
 Figure 52. Data Triangulation
 Figure 53. Key Executives Interviewed

Description

The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing.

This report studies IC Packaging and Testing.

According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.

Market Segmentation