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Semiconductor Packaging and Assembly Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Industry: Electronics & Semiconductor

Published: 2024-01-24

Pages: 123 Pages

Report ld: 2343919

Description
Table of Contents
Table of Figures
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Description
Table of Contents
Table of Figures
PDF Download

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.

The global market for Semiconductor Packaging and Assembly Equipment was estimated to be worth US$ 6258.6 million in 2023 and is forecast to a readjusted size of US$ 8313.8 million by 2030 with a CAGR of 4.2% during the forecast period 2024-2030

Semiconductor Packaging and Assembly Equipment Market Size

M= millions and B=billions

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Assembly Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Packaging and Assembly Equipment by region & country, by Type, and by Application.

The Semiconductor Packaging and Assembly Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Assembly Equipment.

Market Segmentation

Report Metric
Details
Report Title
Semiconductor Packaging and Assembly Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Forecasted Market Size in 2030
US$ 8313.8 million
CAGR(2024-2030)
4.2%
Market Size Available for Years
2019-2030
Global Semiconductor Packaging and Assembly Equipment Companies Covered
Applied Materials, ASMPT, DISCO Corporation, EV Group, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies, SEMES, Suss Microtec, Veeco/CNT, Ulvac Technologies
Global Semiconductor Packaging and Assembly Equipment Market, by Region
North America (U.S., Canada, Mexico)

Europe (Germany, France, UK, Italy, etc.)

Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)

South America (Brazil, etc.)

Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Packaging and Assembly Equipment Market, Segment by Type
Die- Level Packaging and Assembly Equipment

Wafer-Level Packaging and Assembly Equipment
Global Semiconductor Packaging and Assembly Equipment Market, Segment by Application
IDM (Integrated Device Manufacturers)

OSAT (Outsourced Semiconductor Assembly and Test Companies)
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Packaging and Assembly Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Semiconductor Packaging and Assembly Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Semiconductor Packaging and Assembly Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

 1 Market Overview
    1.1 Semiconductor Packaging and Assembly Equipment Product Introduction
    1.2 Global Semiconductor Packaging and Assembly Equipment Market Size Forecast
        1.2.1 Global Semiconductor Packaging and Assembly Equipment Sales Value (2019-2030)
        1.2.2 Global Semiconductor Packaging and Assembly Equipment Sales Volume (2019-2030)
        1.2.3 Global Semiconductor Packaging and Assembly Equipment Sales Price (2019-2030)
    1.3 Semiconductor Packaging and Assembly Equipment Market Trends & Drivers
        1.3.1 Semiconductor Packaging and Assembly Equipment Industry Trends
        1.3.2 Semiconductor Packaging and Assembly Equipment Market Drivers & Opportunity
        1.3.3 Semiconductor Packaging and Assembly Equipment Market Challenges
        1.3.4 Semiconductor Packaging and Assembly Equipment Market Restraints
    1.4 Assumptions and Limitations
    1.5 Study Objectives
    1.6 Years Considered

 2 Competitive Analysis by Company
    2.1 Global Semiconductor Packaging and Assembly Equipment Players Revenue Ranking (2023)
    2.2 Global Semiconductor Packaging and Assembly Equipment Revenue by Company (2019-2024)
    2.3 Global Semiconductor Packaging and Assembly Equipment Players Sales Volume Ranking (2023)
    2.4 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Company Players (2019-2024)
    2.5 Global Semiconductor Packaging and Assembly Equipment Average Price by Company (2019-2024)
    2.6 Key Manufacturers Semiconductor Packaging and Assembly Equipment Manufacturing Base Distribution and Headquarters
    2.7 Key Manufacturers Semiconductor Packaging and Assembly Equipment Product Offered
    2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor Packaging and Assembly Equipment
    2.9 Semiconductor Packaging and Assembly Equipment Market Competitive Analysis
        2.9.1 Semiconductor Packaging and Assembly Equipment Market Concentration Rate (2019-2024)
        2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Packaging and Assembly Equipment Revenue in 2023
        2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Packaging and Assembly Equipment as of 2023)
    2.10 Mergers & Acquisitions, Expansion

 3 Segmentation by Type
    3.1 Introduction by Type
        3.1.1 Die- Level Packaging and Assembly Equipment
        3.1.2 Wafer-Level Packaging and Assembly Equipment
    3.2 Global Semiconductor Packaging and Assembly Equipment Sales Value by Type
        3.2.1 Global Semiconductor Packaging and Assembly Equipment Sales Value by Type (2019 VS 2023 VS 2030)
        3.2.2 Global Semiconductor Packaging and Assembly Equipment Sales Value, by Type (2019-2030)
        3.2.3 Global Semiconductor Packaging and Assembly Equipment Sales Value, by Type (%) (2019-2030)
    3.3 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Type
        3.3.1 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Type (2019 VS 2023 VS 2030)
        3.3.2 Global Semiconductor Packaging and Assembly Equipment Sales Volume, by Type (2019-2030)
        3.3.3 Global Semiconductor Packaging and Assembly Equipment Sales Volume, by Type (%) (2019-2030)
    3.4 Global Semiconductor Packaging and Assembly Equipment Average Price by Type (2019-2030)

 4 Segmentation by Application
    4.1 Introduction by Application
        4.1.1 IDM (Integrated Device Manufacturers)
        4.1.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)
    4.2 Global Semiconductor Packaging and Assembly Equipment Sales Value by Application
        4.2.1 Global Semiconductor Packaging and Assembly Equipment Sales Value by Application (2019 VS 2023 VS 2030)
        4.2.2 Global Semiconductor Packaging and Assembly Equipment Sales Value, by Application (2019-2030)
        4.2.3 Global Semiconductor Packaging and Assembly Equipment Sales Value, by Application (%) (2019-2030)
    4.3 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Application
        4.3.1 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Application (2019 VS 2023 VS 2030)
        4.3.2 Global Semiconductor Packaging and Assembly Equipment Sales Volume, by Application (2019-2030)
        4.3.3 Global Semiconductor Packaging and Assembly Equipment Sales Volume, by Application (%) (2019-2030)
    4.4 Global Semiconductor Packaging and Assembly Equipment Average Price by Application (2019-2030)

 5 Segmentation by Region
    5.1 Global Semiconductor Packaging and Assembly Equipment Sales Value by Region
        5.1.1 Global Semiconductor Packaging and Assembly Equipment Sales Value by Region: 2019 VS 2023 VS 2030
        5.1.2 Global Semiconductor Packaging and Assembly Equipment Sales Value by Region (2019-2024)
        5.1.3 Global Semiconductor Packaging and Assembly Equipment Sales Value by Region (2025-2030)
        5.1.4 Global Semiconductor Packaging and Assembly Equipment Sales Value by Region (%), (2019-2030)
    5.2 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region
        5.2.1 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region: 2019 VS 2023 VS 2030
        5.2.2 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (2019-2024)
        5.2.3 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (2025-2030)
        5.2.4 Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (%), (2019-2030)
    5.3 Global Semiconductor Packaging and Assembly Equipment Average Price by Region (2019-2030)
    5.4 North America
        5.4.1 North America Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        5.4.2 North America Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    5.5 Europe
        5.5.1 Europe Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        5.5.2 Europe Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    5.6 Asia Pacific
        5.6.1 Asia Pacific Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        5.6.2 Asia Pacific Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    5.7 South America
        5.7.1 South America Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        5.7.2 South America Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    5.8 Middle East & Africa
        5.8.1 Middle East & Africa Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        5.8.2 Middle East & Africa Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030

 6 Segmentation by Key Countries/Regions
    6.1 Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Value Growth Trends, 2019 VS 2023 VS 2030
    6.2 Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Value
        6.2.1 Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.2.2 Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Volume, 2019-2030
    6.3 United States
        6.3.1 United States Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.3.2 United States Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
        6.3.3 United States Semiconductor Packaging and Assembly Equipment Sales Value by Application, 2023 VS 2030
    6.4 Europe
        6.4.1 Europe Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.4.2 Europe Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
        6.4.3 Europe Semiconductor Packaging and Assembly Equipment Sales Value by Application, 2023 VS 2030
    6.5 China
        6.5.1 China Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.5.2 China Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
        6.5.3 China Semiconductor Packaging and Assembly Equipment Sales Value by Application, 2023 VS 2030
    6.6 Japan
        6.6.1 Japan Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.6.2 Japan Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
        6.6.3 Japan Semiconductor Packaging and Assembly Equipment Sales Value by Application, 2023 VS 2030
    6.7 South Korea
        6.7.1 South Korea Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.7.2 South Korea Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
        6.7.3 South Korea Semiconductor Packaging and Assembly Equipment Sales Value by Application, 2023 VS 2030
    6.8 Southeast Asia
        6.8.1 Southeast Asia Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.8.2 Southeast Asia Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
        6.8.3 Southeast Asia Semiconductor Packaging and Assembly Equipment Sales Value by Application, 2023 VS 2030
    6.9 India
        6.9.1 India Semiconductor Packaging and Assembly Equipment Sales Value, 2019-2030
        6.9.2 India Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
        6.9.3 India Semiconductor Packaging and Assembly Equipment Sales Value by Application, 2023 VS 2030

 7 Company Profiles
    7.1 Applied Materials
        7.1.1 Applied Materials Company Information
        7.1.2 Applied Materials Introduction and Business Overview
        7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.1.4 Applied Materials Semiconductor Packaging and Assembly Equipment Product Offerings
        7.1.5 Applied Materials Recent Development
    7.2 ASMPT
        7.2.1 ASMPT Company Information
        7.2.2 ASMPT Introduction and Business Overview
        7.2.3 ASMPT Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.2.4 ASMPT Semiconductor Packaging and Assembly Equipment Product Offerings
        7.2.5 ASMPT Recent Development
    7.3 DISCO Corporation
        7.3.1 DISCO Corporation Company Information
        7.3.2 DISCO Corporation Introduction and Business Overview
        7.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.3.4 DISCO Corporation Semiconductor Packaging and Assembly Equipment Product Offerings
        7.3.5 DISCO Corporation Recent Development
    7.4 EV Group
        7.4.1 EV Group Company Information
        7.4.2 EV Group Introduction and Business Overview
        7.4.3 EV Group Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.4.4 EV Group Semiconductor Packaging and Assembly Equipment Product Offerings
        7.4.5 EV Group Recent Development
    7.5 Kulicke and Soffa Industries
        7.5.1 Kulicke and Soffa Industries Company Information
        7.5.2 Kulicke and Soffa Industries Introduction and Business Overview
        7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.5.4 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Product Offerings
        7.5.5 Kulicke and Soffa Industries Recent Development
    7.6 TEL
        7.6.1 TEL Company Information
        7.6.2 TEL Introduction and Business Overview
        7.6.3 TEL Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.6.4 TEL Semiconductor Packaging and Assembly Equipment Product Offerings
        7.6.5 TEL Recent Development
    7.7 Tokyo Seimitsu
        7.7.1 Tokyo Seimitsu Company Information
        7.7.2 Tokyo Seimitsu Introduction and Business Overview
        7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.7.4 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Product Offerings
        7.7.5 Tokyo Seimitsu Recent Development
    7.8 Rudolph Technologies
        7.8.1 Rudolph Technologies Company Information
        7.8.2 Rudolph Technologies Introduction and Business Overview
        7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.8.4 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Product Offerings
        7.8.5 Rudolph Technologies Recent Development
    7.9 SEMES
        7.9.1 SEMES Company Information
        7.9.2 SEMES Introduction and Business Overview
        7.9.3 SEMES Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.9.4 SEMES Semiconductor Packaging and Assembly Equipment Product Offerings
        7.9.5 SEMES Recent Development
    7.10 Suss Microtec
        7.10.1 Suss Microtec Company Information
        7.10.2 Suss Microtec Introduction and Business Overview
        7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.10.4 Suss Microtec Semiconductor Packaging and Assembly Equipment Product Offerings
        7.10.5 Suss Microtec Recent Development
    7.11 Veeco/CNT
        7.11.1 Veeco/CNT Company Information
        7.11.2 Veeco/CNT Introduction and Business Overview
        7.11.3 Veeco/CNT Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.11.4 Veeco/CNT Semiconductor Packaging and Assembly Equipment Product Offerings
        7.11.5 Veeco/CNT Recent Development
    7.12 Ulvac Technologies
        7.12.1 Ulvac Technologies Company Information
        7.12.2 Ulvac Technologies Introduction and Business Overview
        7.12.3 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Sales, Revenue and Gross Margin (2019-2024)
        7.12.4 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Product Offerings
        7.12.5 Ulvac Technologies Recent Development

 8 Industry Chain Analysis
    8.1 Semiconductor Packaging and Assembly Equipment Industrial Chain
    8.2 Semiconductor Packaging and Assembly Equipment Upstream Analysis
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
        8.2.3 Manufacturing Cost Structure
    8.3 Midstream Analysis
    8.4 Downstream Analysis (Customers Analysis)
    8.5 Sales Model and Sales Channels
        8.5.1 Semiconductor Packaging and Assembly Equipment Sales Model
        8.5.2 Sales Channel
        8.5.3 Semiconductor Packaging and Assembly Equipment Distributors

 9 Research Findings and Conclusion

 10 Appendix
    10.1 Research Methodology
        10.1.1 Methodology/Research Approach
        10.1.2 Data Source
    10.2 Author Details
    10.3 Disclaimer

List of Tables
    Table 1. Semiconductor Packaging and Assembly Equipment Market Trends
    Table 2. Semiconductor Packaging and Assembly Equipment Market Drivers & Opportunity
    Table 3. Semiconductor Packaging and Assembly Equipment Market Challenges
    Table 4. Semiconductor Packaging and Assembly Equipment Market Restraints
    Table 5. Global Semiconductor Packaging and Assembly Equipment Revenue by Company (2019-2024) & (US$ Million)
    Table 6. Global Semiconductor Packaging and Assembly Equipment Revenue Market Share by Company (2019-2024)
    Table 7. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Company (2019-2024) & (Units)
    Table 8. Global Semiconductor Packaging and Assembly Equipment Sales Volume Market Share by Company (2019-2024)
    Table 9. Global Market Semiconductor Packaging and Assembly Equipment Price by Company (2019-2024) & (K USD/Unit)
    Table 10. Key Manufacturers Semiconductor Packaging and Assembly Equipment Manufacturing Base Distribution and Headquarters
    Table 11. Key Manufacturers Semiconductor Packaging and Assembly Equipment Product Type
    Table 12. Key Manufacturers Time to Begin Mass Production of Semiconductor Packaging and Assembly Equipment
    Table 13. Global Semiconductor Packaging and Assembly Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Packaging and Assembly Equipment as of 2023)
    Table 15. Mergers & Acquisitions, Expansion Plans
    Table 16. Global Semiconductor Packaging and Assembly Equipment Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
    Table 17. Global Semiconductor Packaging and Assembly Equipment Sales Value by Type (2019-2024) & (US$ Million)
    Table 18. Global Semiconductor Packaging and Assembly Equipment Sales Value by Type (2025-2030) & (US$ Million)
    Table 19. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Value by Type (2019-2024) & (%)
    Table 20. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Value by Type (2025-2030) & (%)
    Table 21. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Type: 2019 VS 2023 VS 2030 (Units)
    Table 22. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Type (2019-2024) & (Units)
    Table 23. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Type (2025-2030) & (Units)
    Table 24. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Volume by Type (2019-2024) & (%)
    Table 25. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Volume by Type (2025-2030) & (%)
    Table 26. Global Semiconductor Packaging and Assembly Equipment Price by Type (2019-2024) & (K USD/Unit)
    Table 27. Global Semiconductor Packaging and Assembly Equipment Price by Type (2025-2030) & (K USD/Unit)
    Table 28. Global Semiconductor Packaging and Assembly Equipment Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)
    Table 29. Global Semiconductor Packaging and Assembly Equipment Sales Value by Application (2019-2024) & (US$ Million)
    Table 30. Global Semiconductor Packaging and Assembly Equipment Sales Value by Application (2025-2030) & (US$ Million)
    Table 31. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Value by Application (2019-2024) & (%)
    Table 32. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Value by Application (2025-2030) & (%)
    Table 33. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Application: 2019 VS 2023 VS 2030 (Units)
    Table 34. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Application (2019-2024) & (Units)
    Table 35. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Application (2025-2030) & (Units)
    Table 36. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Volume by Application (2019-2024) & (%)
    Table 37. Global Semiconductor Packaging and Assembly Equipment Sales Market Share in Volume by Application (2025-2030) & (%)
    Table 38. Global Semiconductor Packaging and Assembly Equipment Price by Application (2019-2024) & (K USD/Unit)
    Table 39. Global Semiconductor Packaging and Assembly Equipment Price by Application (2025-2030) & (K USD/Unit)
    Table 40. Global Semiconductor Packaging and Assembly Equipment Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 41. Global Semiconductor Packaging and Assembly Equipment Sales Value by Region (2019-2024) & (US$ Million)
    Table 42. Global Semiconductor Packaging and Assembly Equipment Sales Value by Region (2025-2030) & (US$ Million)
    Table 43. Global Semiconductor Packaging and Assembly Equipment Sales Value by Region (2019-2024) & (%)
    Table 44. Global Semiconductor Packaging and Assembly Equipment Sales Value by Region (2025-2030) & (%)
    Table 45. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (Units): 2019 VS 2023 VS 2030
    Table 46. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (2019-2024) & (Units)
    Table 47. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (2025-2030) & (Units)
    Table 48. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (2019-2024) & (%)
    Table 49. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Region (2025-2030) & (%)
    Table 50. Global Semiconductor Packaging and Assembly Equipment Average Price by Region (2019-2024) & (K USD/Unit)
    Table 51. Global Semiconductor Packaging and Assembly Equipment Average Price by Region (2025-2030) & (K USD/Unit)
    Table 52. Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
    Table 53. Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2024) & (US$ Million)
    Table 54. Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Value, (2025-2030) & (US$ Million)
    Table 55. Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Volume, (2019-2024) & (Units)
    Table 56. Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Volume, (2025-2030) & (Units)
    Table 57. Applied Materials Company Information
    Table 58. Applied Materials Introduction and Business Overview
    Table 59. Applied Materials Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 60. Applied Materials Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 61. Applied Materials Recent Development
    Table 62. ASMPT Company Information
    Table 63. ASMPT Introduction and Business Overview
    Table 64. ASMPT Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 65. ASMPT Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 66. ASMPT Recent Development
    Table 67. DISCO Corporation Company Information
    Table 68. DISCO Corporation Introduction and Business Overview
    Table 69. DISCO Corporation Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 70. DISCO Corporation Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 71. DISCO Corporation Recent Development
    Table 72. EV Group Company Information
    Table 73. EV Group Introduction and Business Overview
    Table 74. EV Group Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 75. EV Group Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 76. EV Group Recent Development
    Table 77. Kulicke and Soffa Industries Company Information
    Table 78. Kulicke and Soffa Industries Introduction and Business Overview
    Table 79. Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 80. Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 81. Kulicke and Soffa Industries Recent Development
    Table 82. TEL Company Information
    Table 83. TEL Introduction and Business Overview
    Table 84. TEL Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 85. TEL Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 86. TEL Recent Development
    Table 87. Tokyo Seimitsu Company Information
    Table 88. Tokyo Seimitsu Introduction and Business Overview
    Table 89. Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 90. Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 91. Tokyo Seimitsu Recent Development
    Table 92. Rudolph Technologies Company Information
    Table 93. Rudolph Technologies Introduction and Business Overview
    Table 94. Rudolph Technologies Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 95. Rudolph Technologies Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 96. Rudolph Technologies Recent Development
    Table 97. SEMES Company Information
    Table 98. SEMES Introduction and Business Overview
    Table 99. SEMES Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 100. SEMES Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 101. SEMES Recent Development
    Table 102. Suss Microtec Company Information
    Table 103. Suss Microtec Introduction and Business Overview
    Table 104. Suss Microtec Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 105. Suss Microtec Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 106. Suss Microtec Recent Development
    Table 107. Veeco/CNT Company Information
    Table 108. Veeco/CNT Introduction and Business Overview
    Table 109. Veeco/CNT Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 110. Veeco/CNT Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 111. Veeco/CNT Recent Development
    Table 112. Ulvac Technologies Company Information
    Table 113. Ulvac Technologies Introduction and Business Overview
    Table 114. Ulvac Technologies Semiconductor Packaging and Assembly Equipment Sales (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 115. Ulvac Technologies Semiconductor Packaging and Assembly Equipment Product Offerings
    Table 116. Ulvac Technologies Recent Development
    Table 117. Key Raw Materials Lists
    Table 118. Raw Materials Key Suppliers Lists
    Table 119. Semiconductor Packaging and Assembly Equipment Downstream Customers
    Table 120. Semiconductor Packaging and Assembly Equipment Distributors List
    Table 121. Research Programs/Design for This Report
    Table 122. Key Data Information from Secondary Sources
    Table 123. Key Data Information from Primary Sources
List of Figures
    Figure 1. Semiconductor Packaging and Assembly Equipment Product Picture
    Figure 2. Global Semiconductor Packaging and Assembly Equipment Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 3. Global Semiconductor Packaging and Assembly Equipment Sales Value (2019-2030) & (US$ Million)
    Figure 4. Global Semiconductor Packaging and Assembly Equipment Sales Volume (2019-2030) & (Units)
    Figure 5. Global Semiconductor Packaging and Assembly Equipment Sales Price (2019-2030) & (K USD/Unit)
    Figure 6. Semiconductor Packaging and Assembly Equipment Report Years Considered
    Figure 7. Global Semiconductor Packaging and Assembly Equipment Players Revenue Ranking (2023) & (US$ Million)
    Figure 8. Global Semiconductor Packaging and Assembly Equipment Players Sales Volume Ranking (2023) & (Units)
    Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Semiconductor Packaging and Assembly Equipment Revenue in 2023
    Figure 10. Semiconductor Packaging and Assembly Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
    Figure 11. Die- Level Packaging and Assembly Equipment Picture
    Figure 12. Wafer-Level Packaging and Assembly Equipment Picture
    Figure 13. Global Semiconductor Packaging and Assembly Equipment Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 14. Global Semiconductor Packaging and Assembly Equipment Sales Value Market Share by Type, 2023 & 2030
    Figure 15. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Type (2019 VS 2023 VS 2030) & (Units)
    Figure 16. Global Semiconductor Packaging and Assembly Equipment Sales Volume Market Share by Type, 2023 & 2030
    Figure 17. Global Semiconductor Packaging and Assembly Equipment Price by Type (2019-2030) & (K USD/Unit)
    Figure 18. Product Picture of IDM (Integrated Device Manufacturers)
    Figure 19. Product Picture of OSAT (Outsourced Semiconductor Assembly and Test Companies)
    Figure 20. Global Semiconductor Packaging and Assembly Equipment Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 21. Global Semiconductor Packaging and Assembly Equipment Sales Value Market Share by Application, 2023 & 2030
    Figure 22. Global Semiconductor Packaging and Assembly Equipment Sales Volume by Application (2019 VS 2023 VS 2030) & (Units)
    Figure 23. Global Semiconductor Packaging and Assembly Equipment Sales Volume Market Share by Application, 2023 & 2030
    Figure 24. Global Semiconductor Packaging and Assembly Equipment Price by Application (2019-2030) & (K USD/Unit)
    Figure 25. North America Semiconductor Packaging and Assembly Equipment Sales Value (2019-2030) & (US$ Million)
    Figure 26. North America Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    Figure 27. Europe Semiconductor Packaging and Assembly Equipment Sales Value (2019-2030) & (US$ Million)
    Figure 28. Europe Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    Figure 29. Asia Pacific Semiconductor Packaging and Assembly Equipment Sales Value (2019-2030) & (US$ Million)
    Figure 30. Asia Pacific Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    Figure 31. South America Semiconductor Packaging and Assembly Equipment Sales Value (2019-2030) & (US$ Million)
    Figure 32. South America Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    Figure 33. Middle East & Africa Semiconductor Packaging and Assembly Equipment Sales Value (2019-2030) & (US$ Million)
    Figure 34. Middle East & Africa Semiconductor Packaging and Assembly Equipment Sales Value by Country (%), 2023 VS 2030
    Figure 35. Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Value (%), (2019-2030)
    Figure 36. Key Countries/Regions Semiconductor Packaging and Assembly Equipment Sales Volume (%), (2019-2030)
    Figure 37. United States Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2030) & (US$ Million)
    Figure 38. United States Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
    Figure 39. United States Semiconductor Packaging and Assembly Equipment Sales Value by Application (%), 2023 VS 2030
    Figure 40. Europe Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2030) & (US$ Million)
    Figure 41. Europe Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
    Figure 42. Europe Semiconductor Packaging and Assembly Equipment Sales Value by Application (%), 2023 VS 2030
    Figure 43. China Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2030) & (US$ Million)
    Figure 44. China Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
    Figure 45. China Semiconductor Packaging and Assembly Equipment Sales Value by Application (%), 2023 VS 2030
    Figure 46. Japan Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2030) & (US$ Million)
    Figure 47. Japan Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
    Figure 48. Japan Semiconductor Packaging and Assembly Equipment Sales Value by Application (%), 2023 VS 2030
    Figure 49. South Korea Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2030) & (US$ Million)
    Figure 50. South Korea Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
    Figure 51. South Korea Semiconductor Packaging and Assembly Equipment Sales Value by Application (%), 2023 VS 2030
    Figure 52. Southeast Asia Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2030) & (US$ Million)
    Figure 53. Southeast Asia Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
    Figure 54. Southeast Asia Semiconductor Packaging and Assembly Equipment Sales Value by Application (%), 2023 VS 2030
    Figure 55. India Semiconductor Packaging and Assembly Equipment Sales Value, (2019-2030) & (US$ Million)
    Figure 56. India Semiconductor Packaging and Assembly Equipment Sales Value by Type (%), 2023 VS 2030
    Figure 57. India Semiconductor Packaging and Assembly Equipment Sales Value by Application (%), 2023 VS 2030
    Figure 58. Semiconductor Packaging and Assembly Equipment Industrial Chain
    Figure 59. Semiconductor Packaging and Assembly Equipment Manufacturing Cost Structure
    Figure 60. Channels of Distribution (Direct Sales, and Distribution)
    Figure 61. Bottom-up and Top-down Approaches for This Report
    Figure 62. Data Triangulation
    Figure 63. Key Executives Interviewed

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.

The global market for Semiconductor Packaging and Assembly Equipment was estimated to be worth US$ 6258.6 million in 2023 and is forecast to a readjusted size of US$ 8313.8 million by 2030 with a CAGR of 4.2% during the forecast period 2024-2030

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Assembly Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Packaging and Assembly Equipment by region & country, by Type, and by Application.

The Semiconductor Packaging and Assembly Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Assembly Equipment.

Market Segmentation

Industry: Electronics & Semiconductor

Published: 2024-01-24

Pages: 123 Pages

Report ld: 2343919

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