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Semiconductor Advanced Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Industry: Electronics & Semiconductor

Published: 2024-01-24

Pages: 125 Pages

Report ld: 2343901

Description
Table of Contents
Table of Figures
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Description
Table of Contents
Table of Figures
PDF Download

Description

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.

The global market for Semiconductor Advanced Packaging was estimated to be worth US$ 15670 million in 2023 and is forecast to a readjusted size of US$ 26270 million by 2030 with a CAGR of 7.5% during the forecast period 2024-2030

Semiconductor Advanced Packaging Market Size

M= millions and B=billions

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Advanced Packaging, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Semiconductor Advanced Packaging by region & country, by Type, and by Application.

The Semiconductor Advanced Packaging market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Advanced Packaging.

Market Segmentation

Report Metric
Details
Report Title
Semiconductor Advanced Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Forecasted Market Size in 2030
US$ 26270 million
CAGR(2024-2030)
7.5%
Market Size Available for Years
2019-2030
Global Semiconductor Advanced Packaging Companies Covered
Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung, TSMC (Taiwan Semiconductor Manufacturing Company), China Wafer Level CSP, ChipMOS Technologies, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), Signetics, Tianshui Huatian, Veeco/CNT, UTAC Group
Global Semiconductor Advanced Packaging Market, by Region
North America (U.S., Canada, Mexico)

Europe (Germany, France, UK, Italy, etc.)

Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)

South America (Brazil, etc.)

Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Advanced Packaging Market, Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)

Fan-In Wafer-Level Packaging (FI WLP)

Flip Chip (FC)

2.5D/3D
Global Semiconductor Advanced Packaging Market, Segment by Application
Telecommunications

Automotive

Aerospace and Defense

Medical Devices

Consumer Electronics

Other
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Advanced Packaging manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Semiconductor Advanced Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Semiconductor Advanced Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Table of Contents

 1 Market Overview
    1.1 Semiconductor Advanced Packaging Product Introduction
    1.2 Global Semiconductor Advanced Packaging Market Size Forecast
    1.3 Semiconductor Advanced Packaging Market Trends & Drivers
        1.3.1 Semiconductor Advanced Packaging Industry Trends
        1.3.2 Semiconductor Advanced Packaging Market Drivers & Opportunity
        1.3.3 Semiconductor Advanced Packaging Market Challenges
        1.3.4 Semiconductor Advanced Packaging Market Restraints
    1.4 Assumptions and Limitations
    1.5 Study Objectives
    1.6 Years Considered

 2 Competitive Analysis by Company
    2.1 Global Semiconductor Advanced Packaging Players Revenue Ranking (2023)
    2.2 Global Semiconductor Advanced Packaging Revenue by Company (2019-2024)
    2.3 Key Companies Semiconductor Advanced Packaging Manufacturing Base Distribution and Headquarters
    2.4 Key Companies Semiconductor Advanced Packaging Product Offered
    2.5 Key Companies Time to Begin Mass Production of Semiconductor Advanced Packaging
    2.6 Semiconductor Advanced Packaging Market Competitive Analysis
        2.6.1 Semiconductor Advanced Packaging Market Concentration Rate (2019-2024)
        2.6.2 Global 5 and 10 Largest Companies by Semiconductor Advanced Packaging Revenue in 2023
        2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Advanced Packaging as of 2023)
    2.7 Mergers & Acquisitions, Expansion

 3 Segmentation by Type
    3.1 Introduction by Type
        3.1.1 Fan-Out Wafer-Level Packaging (FO WLP)
        3.1.2 Fan-In Wafer-Level Packaging (FI WLP)
        3.1.3 Flip Chip (FC)
        3.1.4 2.5D/3D
    3.2 Global Semiconductor Advanced Packaging Sales Value by Type
        3.2.1 Global Semiconductor Advanced Packaging Sales Value by Type (2019 VS 2023 VS 2030)
        3.2.2 Global Semiconductor Advanced Packaging Sales Value, by Type (2019-2030)
        3.2.3 Global Semiconductor Advanced Packaging Sales Value, by Type (%) (2019-2030)

 4 Segmentation by Application
    4.1 Introduction by Application
        4.1.1 Telecommunications
        4.1.2 Automotive
        4.1.3 Aerospace and Defense
        4.1.4 Medical Devices
        4.1.5 Consumer Electronics
        4.1.6 Other
    4.2 Global Semiconductor Advanced Packaging Sales Value by Application
        4.2.1 Global Semiconductor Advanced Packaging Sales Value by Application (2019 VS 2023 VS 2030)
        4.2.2 Global Semiconductor Advanced Packaging Sales Value, by Application (2019-2030)
        4.2.3 Global Semiconductor Advanced Packaging Sales Value, by Application (%) (2019-2030)

 5 Segmentation by Region
    5.1 Global Semiconductor Advanced Packaging Sales Value by Region
        5.1.1 Global Semiconductor Advanced Packaging Sales Value by Region: 2019 VS 2023 VS 2030
        5.1.2 Global Semiconductor Advanced Packaging Sales Value by Region (2019-2024)
        5.1.3 Global Semiconductor Advanced Packaging Sales Value by Region (2025-2030)
        5.1.4 Global Semiconductor Advanced Packaging Sales Value by Region (%), (2019-2030)
    5.2 North America
        5.2.1 North America Semiconductor Advanced Packaging Sales Value, 2019-2030
        5.2.2 North America Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    5.3 Europe
        5.3.1 Europe Semiconductor Advanced Packaging Sales Value, 2019-2030
        5.3.2 Europe Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    5.4 Asia Pacific
        5.4.1 Asia Pacific Semiconductor Advanced Packaging Sales Value, 2019-2030
        5.4.2 Asia Pacific Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    5.5 South America
        5.5.1 South America Semiconductor Advanced Packaging Sales Value, 2019-2030
        5.5.2 South America Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    5.6 Middle East & Africa
        5.6.1 Middle East & Africa Semiconductor Advanced Packaging Sales Value, 2019-2030
        5.6.2 Middle East & Africa Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030

 6 Segmentation by Key Countries/Regions
    6.1 Key Countries/Regions Semiconductor Advanced Packaging Sales Value Growth Trends, 2019 VS 2023 VS 2030
    6.2 Key Countries/Regions Semiconductor Advanced Packaging Sales Value
    6.3 United States
        6.3.1 United States Semiconductor Advanced Packaging Sales Value, 2019-2030
        6.3.2 United States Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
        6.3.3 United States Semiconductor Advanced Packaging Sales Value by Application, 2023 VS 2030
    6.4 Europe
        6.4.1 Europe Semiconductor Advanced Packaging Sales Value, 2019-2030
        6.4.2 Europe Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
        6.4.3 Europe Semiconductor Advanced Packaging Sales Value by Application, 2023 VS 2030
    6.5 China
        6.5.1 China Semiconductor Advanced Packaging Sales Value, 2019-2030
        6.5.2 China Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
        6.5.3 China Semiconductor Advanced Packaging Sales Value by Application, 2023 VS 2030
    6.6 Japan
        6.6.1 Japan Semiconductor Advanced Packaging Sales Value, 2019-2030
        6.6.2 Japan Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
        6.6.3 Japan Semiconductor Advanced Packaging Sales Value by Application, 2023 VS 2030
    6.7 South Korea
        6.7.1 South Korea Semiconductor Advanced Packaging Sales Value, 2019-2030
        6.7.2 South Korea Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
        6.7.3 South Korea Semiconductor Advanced Packaging Sales Value by Application, 2023 VS 2030
    6.8 Southeast Asia
        6.8.1 Southeast Asia Semiconductor Advanced Packaging Sales Value, 2019-2030
        6.8.2 Southeast Asia Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
        6.8.3 Southeast Asia Semiconductor Advanced Packaging Sales Value by Application, 2023 VS 2030
    6.9 India
        6.9.1 India Semiconductor Advanced Packaging Sales Value, 2019-2030
        6.9.2 India Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
        6.9.3 India Semiconductor Advanced Packaging Sales Value by Application, 2023 VS 2030

 7 Company Profiles
    7.1 Advanced Semiconductor Engineering (ASE)
        7.1.1 Advanced Semiconductor Engineering (ASE) Profile
        7.1.2 Advanced Semiconductor Engineering (ASE) Main Business
        7.1.3 Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Products, Services and Solutions
        7.1.4 Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.1.5 Advanced Semiconductor Engineering (ASE) Recent Developments
    7.2 Amkor Technology
        7.2.1 Amkor Technology Profile
        7.2.2 Amkor Technology Main Business
        7.2.3 Amkor Technology Semiconductor Advanced Packaging Products, Services and Solutions
        7.2.4 Amkor Technology Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.2.5 Amkor Technology Recent Developments
    7.3 Samsung
        7.3.1 Samsung Profile
        7.3.2 Samsung Main Business
        7.3.3 Samsung Semiconductor Advanced Packaging Products, Services and Solutions
        7.3.4 Samsung Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.3.5 TSMC (Taiwan Semiconductor Manufacturing Company) Recent Developments
    7.4 TSMC (Taiwan Semiconductor Manufacturing Company)
        7.4.1 TSMC (Taiwan Semiconductor Manufacturing Company) Profile
        7.4.2 TSMC (Taiwan Semiconductor Manufacturing Company) Main Business
        7.4.3 TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Products, Services and Solutions
        7.4.4 TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.4.5 TSMC (Taiwan Semiconductor Manufacturing Company) Recent Developments
    7.5 China Wafer Level CSP
        7.5.1 China Wafer Level CSP Profile
        7.5.2 China Wafer Level CSP Main Business
        7.5.3 China Wafer Level CSP Semiconductor Advanced Packaging Products, Services and Solutions
        7.5.4 China Wafer Level CSP Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.5.5 China Wafer Level CSP Recent Developments
    7.6 ChipMOS Technologies
        7.6.1 ChipMOS Technologies Profile
        7.6.2 ChipMOS Technologies Main Business
        7.6.3 ChipMOS Technologies Semiconductor Advanced Packaging Products, Services and Solutions
        7.6.4 ChipMOS Technologies Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.6.5 ChipMOS Technologies Recent Developments
    7.7 FlipChip International
        7.7.1 FlipChip International Profile
        7.7.2 FlipChip International Main Business
        7.7.3 FlipChip International Semiconductor Advanced Packaging Products, Services and Solutions
        7.7.4 FlipChip International Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.7.5 FlipChip International Recent Developments
    7.8 HANA Micron
        7.8.1 HANA Micron Profile
        7.8.2 HANA Micron Main Business
        7.8.3 HANA Micron Semiconductor Advanced Packaging Products, Services and Solutions
        7.8.4 HANA Micron Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.8.5 HANA Micron Recent Developments
    7.9 Interconnect Systems (Molex)
        7.9.1 Interconnect Systems (Molex) Profile
        7.9.2 Interconnect Systems (Molex) Main Business
        7.9.3 Interconnect Systems (Molex) Semiconductor Advanced Packaging Products, Services and Solutions
        7.9.4 Interconnect Systems (Molex) Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.9.5 Interconnect Systems (Molex) Recent Developments
    7.10 Jiangsu Changjiang Electronics Technology (JCET)
        7.10.1 Jiangsu Changjiang Electronics Technology (JCET) Profile
        7.10.2 Jiangsu Changjiang Electronics Technology (JCET) Main Business
        7.10.3 Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Products, Services and Solutions
        7.10.4 Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.10.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Developments
    7.11 King Yuan Electronics
        7.11.1 King Yuan Electronics Profile
        7.11.2 King Yuan Electronics Main Business
        7.11.3 King Yuan Electronics Semiconductor Advanced Packaging Products, Services and Solutions
        7.11.4 King Yuan Electronics Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.11.5 King Yuan Electronics Recent Developments
    7.12 Tongfu Microelectronics
        7.12.1 Tongfu Microelectronics Profile
        7.12.2 Tongfu Microelectronics Main Business
        7.12.3 Tongfu Microelectronics Semiconductor Advanced Packaging Products, Services and Solutions
        7.12.4 Tongfu Microelectronics Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.12.5 Tongfu Microelectronics Recent Developments
    7.13 Nepes
        7.13.1 Nepes Profile
        7.13.2 Nepes Main Business
        7.13.3 Nepes Semiconductor Advanced Packaging Products, Services and Solutions
        7.13.4 Nepes Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.13.5 Nepes Recent Developments
    7.14 Powertech Technology (PTI)
        7.14.1 Powertech Technology (PTI) Profile
        7.14.2 Powertech Technology (PTI) Main Business
        7.14.3 Powertech Technology (PTI) Semiconductor Advanced Packaging Products, Services and Solutions
        7.14.4 Powertech Technology (PTI) Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.14.5 Powertech Technology (PTI) Recent Developments
    7.15 Signetics
        7.15.1 Signetics Profile
        7.15.2 Signetics Main Business
        7.15.3 Signetics Semiconductor Advanced Packaging Products, Services and Solutions
        7.15.4 Signetics Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.15.5 Signetics Recent Developments
    7.16 Tianshui Huatian
        7.16.1 Tianshui Huatian Profile
        7.16.2 Tianshui Huatian Main Business
        7.16.3 Tianshui Huatian Semiconductor Advanced Packaging Products, Services and Solutions
        7.16.4 Tianshui Huatian Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.16.5 Tianshui Huatian Recent Developments
    7.17 Veeco/CNT
        7.17.1 Veeco/CNT Profile
        7.17.2 Veeco/CNT Main Business
        7.17.3 Veeco/CNT Semiconductor Advanced Packaging Products, Services and Solutions
        7.17.4 Veeco/CNT Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.17.5 Veeco/CNT Recent Developments
    7.18 UTAC Group
        7.18.1 UTAC Group Profile
        7.18.2 UTAC Group Main Business
        7.18.3 UTAC Group Semiconductor Advanced Packaging Products, Services and Solutions
        7.18.4 UTAC Group Semiconductor Advanced Packaging Revenue (US$ Million) & (2019-2024)
        7.18.5 UTAC Group Recent Developments

 8 Industry Chain Analysis
    8.1 Semiconductor Advanced Packaging Industrial Chain
    8.2 Semiconductor Advanced Packaging Upstream Analysis
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
        8.2.3 Manufacturing Cost Structure
    8.3 Midstream Analysis
    8.4 Downstream Analysis (Customers Analysis)
    8.5 Sales Model and Sales Channels
        8.5.1 Semiconductor Advanced Packaging Sales Model
        8.5.2 Sales Channel
        8.5.3 Semiconductor Advanced Packaging Distributors

 9 Research Findings and Conclusion

 10 Appendix
    10.1 Research Methodology
        10.1.1 Methodology/Research Approach
        10.1.2 Data Source
    10.2 Author Details
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. Semiconductor Advanced Packaging Market Trends
    Table 2. Semiconductor Advanced Packaging Market Drivers & Opportunity
    Table 3. Semiconductor Advanced Packaging Market Challenges
    Table 4. Semiconductor Advanced Packaging Market Restraints
    Table 5. Global Semiconductor Advanced Packaging Revenue by Company (2019-2024) & (US$ Million)
    Table 6. Global Semiconductor Advanced Packaging Revenue Market Share by Company (2019-2024)
    Table 7. Key Companies Semiconductor Advanced Packaging Manufacturing Base Distribution and Headquarters
    Table 8. Key Companies Semiconductor Advanced Packaging Product Type
    Table 9. Key Companies Time to Begin Mass Production of Semiconductor Advanced Packaging
    Table 10. Global Semiconductor Advanced Packaging Companies Market Concentration Ratio (CR5 and HHI)
    Table 11. Global Top Companies Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Advanced Packaging as of 2023)
    Table 12. Mergers & Acquisitions, Expansion Plans
    Table 13. Global Semiconductor Advanced Packaging Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
    Table 14. Global Semiconductor Advanced Packaging Sales Value by Type (2019-2024) & (US$ Million)
    Table 15. Global Semiconductor Advanced Packaging Sales Value by Type (2025-2030) & (US$ Million)
    Table 16. Global Semiconductor Advanced Packaging Sales Market Share in Value by Type (2019-2024) & (%)
    Table 17. Global Semiconductor Advanced Packaging Sales Market Share in Value by Type (2025-2030) & (%)
    Table 18. Global Semiconductor Advanced Packaging Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)
    Table 19. Global Semiconductor Advanced Packaging Sales Value by Application (2019-2024) & (US$ Million)
    Table 20. Global Semiconductor Advanced Packaging Sales Value by Application (2025-2030) & (US$ Million)
    Table 21. Global Semiconductor Advanced Packaging Sales Market Share in Value by Application (2019-2024) & (%)
    Table 22. Global Semiconductor Advanced Packaging Sales Market Share in Value by Application (2025-2030) & (%)
    Table 23. Global Semiconductor Advanced Packaging Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 24. Global Semiconductor Advanced Packaging Sales Value by Region (2019-2024) & (US$ Million)
    Table 25. Global Semiconductor Advanced Packaging Sales Value by Region (2025-2030) & (US$ Million)
    Table 26. Global Semiconductor Advanced Packaging Sales Value by Region (2019-2024) & (%)
    Table 27. Global Semiconductor Advanced Packaging Sales Value by Region (2025-2030) & (%)
    Table 28. Key Countries/Regions Semiconductor Advanced Packaging Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
    Table 29. Key Countries/Regions Semiconductor Advanced Packaging Sales Value, (2019-2024) & (US$ Million)
    Table 30. Key Countries/Regions Semiconductor Advanced Packaging Sales Value, (2025-2030) & (US$ Million)
    Table 31. Advanced Semiconductor Engineering (ASE) Basic Information List
    Table 32. Advanced Semiconductor Engineering (ASE) Description and Business Overview
    Table 33. Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Products, Services and Solutions
    Table 34. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Advanced Semiconductor Engineering (ASE) (2019-2024)
    Table 35. Advanced Semiconductor Engineering (ASE) Recent Developments
    Table 36. Amkor Technology Basic Information List
    Table 37. Amkor Technology Description and Business Overview
    Table 38. Amkor Technology Semiconductor Advanced Packaging Products, Services and Solutions
    Table 39. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Amkor Technology (2019-2024)
    Table 40. Amkor Technology Recent Developments
    Table 41. Samsung Basic Information List
    Table 42. Samsung Description and Business Overview
    Table 43. Samsung Semiconductor Advanced Packaging Products, Services and Solutions
    Table 44. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Samsung (2019-2024)
    Table 45. Samsung Recent Developments
    Table 46. TSMC (Taiwan Semiconductor Manufacturing Company) Basic Information List
    Table 47. TSMC (Taiwan Semiconductor Manufacturing Company) Description and Business Overview
    Table 48. TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Products, Services and Solutions
    Table 49. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of TSMC (Taiwan Semiconductor Manufacturing Company) (2019-2024)
    Table 50. TSMC (Taiwan Semiconductor Manufacturing Company) Recent Developments
    Table 51. China Wafer Level CSP Basic Information List
    Table 52. China Wafer Level CSP Description and Business Overview
    Table 53. China Wafer Level CSP Semiconductor Advanced Packaging Products, Services and Solutions
    Table 54. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of China Wafer Level CSP (2019-2024)
    Table 55. China Wafer Level CSP Recent Developments
    Table 56. ChipMOS Technologies Basic Information List
    Table 57. ChipMOS Technologies Description and Business Overview
    Table 58. ChipMOS Technologies Semiconductor Advanced Packaging Products, Services and Solutions
    Table 59. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of ChipMOS Technologies (2019-2024)
    Table 60. ChipMOS Technologies Recent Developments
    Table 61. FlipChip International Basic Information List
    Table 62. FlipChip International Description and Business Overview
    Table 63. FlipChip International Semiconductor Advanced Packaging Products, Services and Solutions
    Table 64. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of FlipChip International (2019-2024)
    Table 65. FlipChip International Recent Developments
    Table 66. HANA Micron Basic Information List
    Table 67. HANA Micron Description and Business Overview
    Table 68. HANA Micron Semiconductor Advanced Packaging Products, Services and Solutions
    Table 69. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of HANA Micron (2019-2024)
    Table 70. HANA Micron Recent Developments
    Table 71. Interconnect Systems (Molex) Basic Information List
    Table 72. Interconnect Systems (Molex) Description and Business Overview
    Table 73. Interconnect Systems (Molex) Semiconductor Advanced Packaging Products, Services and Solutions
    Table 74. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Interconnect Systems (Molex) (2019-2024)
    Table 75. Interconnect Systems (Molex) Recent Developments
    Table 76. Jiangsu Changjiang Electronics Technology (JCET) Basic Information List
    Table 77. Jiangsu Changjiang Electronics Technology (JCET) Description and Business Overview
    Table 78. Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Products, Services and Solutions
    Table 79. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Jiangsu Changjiang Electronics Technology (JCET) (2019-2024)
    Table 80. Jiangsu Changjiang Electronics Technology (JCET) Recent Developments
    Table 81. King Yuan Electronics Basic Information List
    Table 82. King Yuan Electronics Description and Business Overview
    Table 83. King Yuan Electronics Semiconductor Advanced Packaging Products, Services and Solutions
    Table 84. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of King Yuan Electronics (2019-2024)
    Table 85. King Yuan Electronics Recent Developments
    Table 86. Tongfu Microelectronics Basic Information List
    Table 87. Tongfu Microelectronics Description and Business Overview
    Table 88. Tongfu Microelectronics Semiconductor Advanced Packaging Products, Services and Solutions
    Table 89. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Tongfu Microelectronics (2019-2024)
    Table 90. Tongfu Microelectronics Recent Developments
    Table 91. Nepes Basic Information List
    Table 92. Nepes Description and Business Overview
    Table 93. Nepes Semiconductor Advanced Packaging Products, Services and Solutions
    Table 94. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Nepes (2019-2024)
    Table 95. Nepes Recent Developments
    Table 96. Powertech Technology (PTI) Basic Information List
    Table 97. Powertech Technology (PTI) Description and Business Overview
    Table 98. Powertech Technology (PTI) Semiconductor Advanced Packaging Products, Services and Solutions
    Table 99. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Powertech Technology (PTI) (2019-2024)
    Table 100. Powertech Technology (PTI) Recent Developments
    Table 101. Signetics Basic Information List
    Table 102. Signetics Description and Business Overview
    Table 103. Signetics Semiconductor Advanced Packaging Products, Services and Solutions
    Table 104. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Signetics (2019-2024)
    Table 105. Signetics Recent Developments
    Table 106. Tianshui Huatian Basic Information List
    Table 107. Tianshui Huatian Description and Business Overview
    Table 108. Tianshui Huatian Semiconductor Advanced Packaging Products, Services and Solutions
    Table 109. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Tianshui Huatian (2019-2024)
    Table 110. Tianshui Huatian Recent Developments
    Table 111. Veeco/CNT Basic Information List
    Table 112. Veeco/CNT Description and Business Overview
    Table 113. Veeco/CNT Semiconductor Advanced Packaging Products, Services and Solutions
    Table 114. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of Veeco/CNT (2019-2024)
    Table 115. Veeco/CNT Recent Developments
    Table 116. UTAC Group Basic Information List
    Table 117. UTAC Group Description and Business Overview
    Table 118. UTAC Group Semiconductor Advanced Packaging Products, Services and Solutions
    Table 119. Revenue (US$ Million) in Semiconductor Advanced Packaging Business of UTAC Group (2019-2024)
    Table 120. UTAC Group Recent Developments
    Table 121. Key Raw Materials Lists
    Table 122. Raw Materials Key Suppliers Lists
    Table 123. Semiconductor Advanced Packaging Downstream Customers
    Table 124. Semiconductor Advanced Packaging Distributors List
    Table 125. Research Programs/Design for This Report
    Table 126. Key Data Information from Secondary Sources
    Table 127. Key Data Information from Primary Sources
    Table 128. Business Unit and Senior & Team Lead Analysts
List of Figures
    Figure 1. Semiconductor Advanced Packaging Product Picture
    Figure 2. Global Semiconductor Advanced Packaging Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 3. Global Semiconductor Advanced Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 4. Semiconductor Advanced Packaging Report Years Considered
    Figure 5. Global Semiconductor Advanced Packaging Players Revenue Ranking (2023) & (US$ Million)
    Figure 6. The 5 and 10 Largest Manufacturers in the World: Market Share by Semiconductor Advanced Packaging Revenue in 2023
    Figure 7. Semiconductor Advanced Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
    Figure 8. Fan-Out Wafer-Level Packaging (FO WLP) Picture
    Figure 9. Fan-In Wafer-Level Packaging (FI WLP) Picture
    Figure 10. Flip Chip (FC) Picture
    Figure 11. 2.5D/3D Picture
    Figure 12. Global Semiconductor Advanced Packaging Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 13. Global Semiconductor Advanced Packaging Sales Value Market Share by Type, 2023 & 2030
    Figure 14. Product Picture of Telecommunications
    Figure 15. Product Picture of Automotive
    Figure 16. Product Picture of Aerospace and Defense
    Figure 17. Product Picture of Medical Devices
    Figure 18. Product Picture of Consumer Electronics
    Figure 19. Product Picture of Other
    Figure 20. Global Semiconductor Advanced Packaging Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 21. Global Semiconductor Advanced Packaging Sales Value Market Share by Application, 2023 & 2030
    Figure 22. North America Semiconductor Advanced Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 23. North America Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 24. Europe Semiconductor Advanced Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 25. Europe Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 26. Asia Pacific Semiconductor Advanced Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 27. Asia Pacific Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 28. South America Semiconductor Advanced Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 29. South America Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 30. Middle East & Africa Semiconductor Advanced Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 31. Middle East & Africa Semiconductor Advanced Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 32. Key Countries/Regions Semiconductor Advanced Packaging Sales Value (%), (2019-2030)
    Figure 33. United States Semiconductor Advanced Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 34. United States Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 35. United States Semiconductor Advanced Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 36. Europe Semiconductor Advanced Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 37. Europe Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 38. Europe Semiconductor Advanced Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 39. China Semiconductor Advanced Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 40. China Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 41. China Semiconductor Advanced Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 42. Japan Semiconductor Advanced Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 43. Japan Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 44. Japan Semiconductor Advanced Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 45. South Korea Semiconductor Advanced Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 46. South Korea Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 47. South Korea Semiconductor Advanced Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 48. Southeast Asia Semiconductor Advanced Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 49. Southeast Asia Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 50. Southeast Asia Semiconductor Advanced Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 51. India Semiconductor Advanced Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 52. India Semiconductor Advanced Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 53. India Semiconductor Advanced Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 54. Semiconductor Advanced Packaging Industrial Chain
    Figure 55. Semiconductor Advanced Packaging Manufacturing Cost Structure
    Figure 56. Channels of Distribution (Direct Sales, and Distribution)
    Figure 57. Bottom-up and Top-down Approaches for This Report
    Figure 58. Data Triangulation

Description

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.

The global market for Semiconductor Advanced Packaging was estimated to be worth US$ 15670 million in 2023 and is forecast to a readjusted size of US$ 26270 million by 2030 with a CAGR of 7.5% during the forecast period 2024-2030

Market Segmentation