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In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux. Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Solder Ball Packaging Material Market Size
M= millions and B=billions
The global market for Solder Ball Packaging Material was estimated to be worth US$ 242.3 million in 2023 and is forecast to a readjusted size of US$ 346.5 million by 2030 with a CAGR of 6.5% during the forecast period 2024-2030 Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share. Report Scope This report aims to provide a comprehensive presentation of the global market for Solder Ball Packaging Material, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Solder Ball Packaging Material by region & country, by Type, and by Application. The Solder Ball Packaging Material market size, estimations, and forecasts are provided in terms of sales volume (Million Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Ball Packaging Material. Market Segmentation
Report Metric
Details
Report Title
Solder Ball Packaging Material - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Forecasted Market Size in 2030
US$ 346.5 million
CAGR(2024-2030)
6.5%
Market Size Available for Years
2019-2030
Global Solder Ball Packaging Material Companies Covered
Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems
Global Solder Ball Packaging Material Market, by Region
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Solder Ball Packaging Material Market, Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Global Solder Ball Packaging Material Market, Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends
Chapter Outline Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. Chapter 2: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc. Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 5: Sales, revenue of Solder Ball Packaging Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world. Chapter 6: Sales, revenue of Solder Ball Packaging Material in country level. It provides sigmate data by Type, and by Application for each country/region. Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry. Chapter 9: Conclusion.
1 Market Overview
1.1 Solder Ball Packaging Material Product Introduction
1.2 Global Solder Ball Packaging Material Market Size Forecast
1.2.1 Global Solder Ball Packaging Material Sales Value (2019-2030)
1.2.2 Global Solder Ball Packaging Material Sales Volume (2019-2030)
1.2.3 Global Solder Ball Packaging Material Sales Price (2019-2030)
1.3 Solder Ball Packaging Material Market Trends & Drivers
1.3.1 Solder Ball Packaging Material Industry Trends
1.3.2 Solder Ball Packaging Material Market Drivers & Opportunity
1.3.3 Solder Ball Packaging Material Market Challenges
1.3.4 Solder Ball Packaging Material Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered2 Competitive Analysis by Company
2.1 Global Solder Ball Packaging Material Players Revenue Ranking (2023)
2.2 Global Solder Ball Packaging Material Revenue by Company (2019-2024)
2.3 Global Solder Ball Packaging Material Players Sales Volume Ranking (2023)
2.4 Global Solder Ball Packaging Material Sales Volume by Company Players (2019-2024)
2.5 Global Solder Ball Packaging Material Average Price by Company (2019-2024)
2.6 Key Manufacturers Solder Ball Packaging Material Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Solder Ball Packaging Material Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Solder Ball Packaging Material
2.9 Solder Ball Packaging Material Market Competitive Analysis
2.9.1 Solder Ball Packaging Material Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Solder Ball Packaging Material Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Solder Ball Packaging Material as of 2023)
2.10 Mergers & Acquisitions, Expansion3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Lead Solder Ball
3.1.2 Lead Free Solder Ball
3.2 Global Solder Ball Packaging Material Sales Value by Type
3.2.1 Global Solder Ball Packaging Material Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Solder Ball Packaging Material Sales Value, by Type (2019-2030)
3.2.3 Global Solder Ball Packaging Material Sales Value, by Type (%) (2019-2030)
3.3 Global Solder Ball Packaging Material Sales Volume by Type
3.3.1 Global Solder Ball Packaging Material Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Solder Ball Packaging Material Sales Volume, by Type (2019-2030)
3.3.3 Global Solder Ball Packaging Material Sales Volume, by Type (%) (2019-2030)
3.4 Global Solder Ball Packaging Material Average Price by Type (2019-2030)4 Segmentation by Application
4.1 Introduction by Application
4.1.1 BGA
4.1.2 CSP & WLCSP
4.1.3 Flip-Chip & Others
4.2 Global Solder Ball Packaging Material Sales Value by Application
4.2.1 Global Solder Ball Packaging Material Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Solder Ball Packaging Material Sales Value, by Application (2019-2030)
4.2.3 Global Solder Ball Packaging Material Sales Value, by Application (%) (2019-2030)
4.3 Global Solder Ball Packaging Material Sales Volume by Application
4.3.1 Global Solder Ball Packaging Material Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Solder Ball Packaging Material Sales Volume, by Application (2019-2030)
4.3.3 Global Solder Ball Packaging Material Sales Volume, by Application (%) (2019-2030)
4.4 Global Solder Ball Packaging Material Average Price by Application (2019-2030)5 Segmentation by Region
5.1 Global Solder Ball Packaging Material Sales Value by Region
5.1.1 Global Solder Ball Packaging Material Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Solder Ball Packaging Material Sales Value by Region (2019-2024)
5.1.3 Global Solder Ball Packaging Material Sales Value by Region (2025-2030)
5.1.4 Global Solder Ball Packaging Material Sales Value by Region (%), (2019-2030)
5.2 Global Solder Ball Packaging Material Sales Volume by Region
5.2.1 Global Solder Ball Packaging Material Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Solder Ball Packaging Material Sales Volume by Region (2019-2024)
5.2.3 Global Solder Ball Packaging Material Sales Volume by Region (2025-2030)
5.2.4 Global Solder Ball Packaging Material Sales Volume by Region (%), (2019-2030)
5.3 Global Solder Ball Packaging Material Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Solder Ball Packaging Material Sales Value, 2019-2030
5.4.2 North America Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Solder Ball Packaging Material Sales Value, 2019-2030
5.5.2 Europe Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Solder Ball Packaging Material Sales Value, 2019-2030
5.6.2 Asia Pacific Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Solder Ball Packaging Material Sales Value, 2019-2030
5.7.2 South America Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Solder Ball Packaging Material Sales Value, 2019-2030
5.8.2 Middle East & Africa Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 20306 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Solder Ball Packaging Material Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Solder Ball Packaging Material Sales Value
6.2.1 Key Countries/Regions Solder Ball Packaging Material Sales Value, 2019-2030
6.2.2 Key Countries/Regions Solder Ball Packaging Material Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Solder Ball Packaging Material Sales Value, 2019-2030
6.3.2 United States Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Solder Ball Packaging Material Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Solder Ball Packaging Material Sales Value, 2019-2030
6.4.2 Europe Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Solder Ball Packaging Material Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Solder Ball Packaging Material Sales Value, 2019-2030
6.5.2 China Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030
6.5.3 China Solder Ball Packaging Material Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Solder Ball Packaging Material Sales Value, 2019-2030
6.6.2 Japan Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Solder Ball Packaging Material Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Solder Ball Packaging Material Sales Value, 2019-2030
6.7.2 South Korea Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Solder Ball Packaging Material Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Solder Ball Packaging Material Sales Value, 2019-2030
6.8.2 Southeast Asia Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Solder Ball Packaging Material Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Solder Ball Packaging Material Sales Value, 2019-2030
6.9.2 India Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030
6.9.3 India Solder Ball Packaging Material Sales Value by Application, 2023 VS 20307 Company Profiles
7.1 Senju Metal
7.1.1 Senju Metal Company Information
7.1.2 Senju Metal Introduction and Business Overview
7.1.3 Senju Metal Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Senju Metal Solder Ball Packaging Material Product Offerings
7.1.5 Senju Metal Recent Development
7.2 DS HiMetal
7.2.1 DS HiMetal Company Information
7.2.2 DS HiMetal Introduction and Business Overview
7.2.3 DS HiMetal Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.2.4 DS HiMetal Solder Ball Packaging Material Product Offerings
7.2.5 DS HiMetal Recent Development
7.3 MKE
7.3.1 MKE Company Information
7.3.2 MKE Introduction and Business Overview
7.3.3 MKE Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.3.4 MKE Solder Ball Packaging Material Product Offerings
7.3.5 MKE Recent Development
7.4 YCTC
7.4.1 YCTC Company Information
7.4.2 YCTC Introduction and Business Overview
7.4.3 YCTC Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.4.4 YCTC Solder Ball Packaging Material Product Offerings
7.4.5 YCTC Recent Development
7.5 Nippon Micrometal
7.5.1 Nippon Micrometal Company Information
7.5.2 Nippon Micrometal Introduction and Business Overview
7.5.3 Nippon Micrometal Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Nippon Micrometal Solder Ball Packaging Material Product Offerings
7.5.5 Nippon Micrometal Recent Development
7.6 Accurus
7.6.1 Accurus Company Information
7.6.2 Accurus Introduction and Business Overview
7.6.3 Accurus Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Accurus Solder Ball Packaging Material Product Offerings
7.6.5 Accurus Recent Development
7.7 PMTC
7.7.1 PMTC Company Information
7.7.2 PMTC Introduction and Business Overview
7.7.3 PMTC Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.7.4 PMTC Solder Ball Packaging Material Product Offerings
7.7.5 PMTC Recent Development
7.8 Shanghai hiking solder material
7.8.1 Shanghai hiking solder material Company Information
7.8.2 Shanghai hiking solder material Introduction and Business Overview
7.8.3 Shanghai hiking solder material Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Shanghai hiking solder material Solder Ball Packaging Material Product Offerings
7.8.5 Shanghai hiking solder material Recent Development
7.9 Shenmao Technology
7.9.1 Shenmao Technology Company Information
7.9.2 Shenmao Technology Introduction and Business Overview
7.9.3 Shenmao Technology Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Shenmao Technology Solder Ball Packaging Material Product Offerings
7.9.5 Shenmao Technology Recent Development
7.10 Indium Corporation
7.10.1 Indium Corporation Company Information
7.10.2 Indium Corporation Introduction and Business Overview
7.10.3 Indium Corporation Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Indium Corporation Solder Ball Packaging Material Product Offerings
7.10.5 Indium Corporation Recent Development
7.11 Jovy Systems
7.11.1 Jovy Systems Company Information
7.11.2 Jovy Systems Introduction and Business Overview
7.11.3 Jovy Systems Solder Ball Packaging Material Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Jovy Systems Solder Ball Packaging Material Product Offerings
7.11.5 Jovy Systems Recent Development8 Industry Chain Analysis
8.1 Solder Ball Packaging Material Industrial Chain
8.2 Solder Ball Packaging Material Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Solder Ball Packaging Material Sales Model
8.5.2 Sales Channel
8.5.3 Solder Ball Packaging Material Distributors9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
List of Tables Table 1. Solder Ball Packaging Material Market Trends Table 2. Solder Ball Packaging Material Market Drivers & Opportunity Table 3. Solder Ball Packaging Material Market Challenges Table 4. Solder Ball Packaging Material Market Restraints Table 5. Global Solder Ball Packaging Material Revenue by Company (2019-2024) & (US$ Million) Table 6. Global Solder Ball Packaging Material Revenue Market Share by Company (2019-2024) Table 7. Global Solder Ball Packaging Material Sales Volume by Company (2019-2024) & (Million Units) Table 8. Global Solder Ball Packaging Material Sales Volume Market Share by Company (2019-2024) Table 9. Global Market Solder Ball Packaging Material Price by Company (2019-2024) & (USD/Million Units) Table 10. Key Manufacturers Solder Ball Packaging Material Manufacturing Base Distribution and Headquarters Table 11. Key Manufacturers Solder Ball Packaging Material Product Type Table 12. Key Manufacturers Time to Begin Mass Production of Solder Ball Packaging Material Table 13. Global Solder Ball Packaging Material Manufacturers Market Concentration Ratio (CR5 and HHI) Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Solder Ball Packaging Material as of 2023) Table 15. Mergers & Acquisitions, Expansion Plans Table 16. Global Solder Ball Packaging Material Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million) Table 17. Global Solder Ball Packaging Material Sales Value by Type (2019-2024) & (US$ Million) Table 18. Global Solder Ball Packaging Material Sales Value by Type (2025-2030) & (US$ Million) Table 19. Global Solder Ball Packaging Material Sales Market Share in Value by Type (2019-2024) & (%) Table 20. Global Solder Ball Packaging Material Sales Market Share in Value by Type (2025-2030) & (%) Table 21. Global Solder Ball Packaging Material Sales Volume by Type: 2019 VS 2023 VS 2030 (Million Units) Table 22. Global Solder Ball Packaging Material Sales Volume by Type (2019-2024) & (Million Units) Table 23. Global Solder Ball Packaging Material Sales Volume by Type (2025-2030) & (Million Units) Table 24. Global Solder Ball Packaging Material Sales Market Share in Volume by Type (2019-2024) & (%) Table 25. Global Solder Ball Packaging Material Sales Market Share in Volume by Type (2025-2030) & (%) Table 26. Global Solder Ball Packaging Material Price by Type (2019-2024) & (USD/Million Units) Table 27. Global Solder Ball Packaging Material Price by Type (2025-2030) & (USD/Million Units) Table 28. Global Solder Ball Packaging Material Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million) Table 29. Global Solder Ball Packaging Material Sales Value by Application (2019-2024) & (US$ Million) Table 30. Global Solder Ball Packaging Material Sales Value by Application (2025-2030) & (US$ Million) Table 31. Global Solder Ball Packaging Material Sales Market Share in Value by Application (2019-2024) & (%) Table 32. Global Solder Ball Packaging Material Sales Market Share in Value by Application (2025-2030) & (%) Table 33. Global Solder Ball Packaging Material Sales Volume by Application: 2019 VS 2023 VS 2030 (Million Units) Table 34. Global Solder Ball Packaging Material Sales Volume by Application (2019-2024) & (Million Units) Table 35. Global Solder Ball Packaging Material Sales Volume by Application (2025-2030) & (Million Units) Table 36. Global Solder Ball Packaging Material Sales Market Share in Volume by Application (2019-2024) & (%) Table 37. Global Solder Ball Packaging Material Sales Market Share in Volume by Application (2025-2030) & (%) Table 38. Global Solder Ball Packaging Material Price by Application (2019-2024) & (USD/Million Units) Table 39. Global Solder Ball Packaging Material Price by Application (2025-2030) & (USD/Million Units) Table 40. Global Solder Ball Packaging Material Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million) Table 41. Global Solder Ball Packaging Material Sales Value by Region (2019-2024) & (US$ Million) Table 42. Global Solder Ball Packaging Material Sales Value by Region (2025-2030) & (US$ Million) Table 43. Global Solder Ball Packaging Material Sales Value by Region (2019-2024) & (%) Table 44. Global Solder Ball Packaging Material Sales Value by Region (2025-2030) & (%) Table 45. Global Solder Ball Packaging Material Sales Volume by Region (Million Units): 2019 VS 2023 VS 2030 Table 46. Global Solder Ball Packaging Material Sales Volume by Region (2019-2024) & (Million Units) Table 47. Global Solder Ball Packaging Material Sales Volume by Region (2025-2030) & (Million Units) Table 48. Global Solder Ball Packaging Material Sales Volume by Region (2019-2024) & (%) Table 49. Global Solder Ball Packaging Material Sales Volume by Region (2025-2030) & (%) Table 50. Global Solder Ball Packaging Material Average Price by Region (2019-2024) & (USD/Million Units) Table 51. Global Solder Ball Packaging Material Average Price by Region (2025-2030) & (USD/Million Units) Table 52. Key Countries/Regions Solder Ball Packaging Material Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030 Table 53. Key Countries/Regions Solder Ball Packaging Material Sales Value, (2019-2024) & (US$ Million) Table 54. Key Countries/Regions Solder Ball Packaging Material Sales Value, (2025-2030) & (US$ Million) Table 55. Key Countries/Regions Solder Ball Packaging Material Sales Volume, (2019-2024) & (Million Units) Table 56. Key Countries/Regions Solder Ball Packaging Material Sales Volume, (2025-2030) & (Million Units) Table 57. Senju Metal Company Information Table 58. Senju Metal Introduction and Business Overview Table 59. Senju Metal Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 60. Senju Metal Solder Ball Packaging Material Product Offerings Table 61. Senju Metal Recent Development Table 62. DS HiMetal Company Information Table 63. DS HiMetal Introduction and Business Overview Table 64. DS HiMetal Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 65. DS HiMetal Solder Ball Packaging Material Product Offerings Table 66. DS HiMetal Recent Development Table 67. MKE Company Information Table 68. MKE Introduction and Business Overview Table 69. MKE Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 70. MKE Solder Ball Packaging Material Product Offerings Table 71. MKE Recent Development Table 72. YCTC Company Information Table 73. YCTC Introduction and Business Overview Table 74. YCTC Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 75. YCTC Solder Ball Packaging Material Product Offerings Table 76. YCTC Recent Development Table 77. Nippon Micrometal Company Information Table 78. Nippon Micrometal Introduction and Business Overview Table 79. Nippon Micrometal Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 80. Nippon Micrometal Solder Ball Packaging Material Product Offerings Table 81. Nippon Micrometal Recent Development Table 82. Accurus Company Information Table 83. Accurus Introduction and Business Overview Table 84. Accurus Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 85. Accurus Solder Ball Packaging Material Product Offerings Table 86. Accurus Recent Development Table 87. PMTC Company Information Table 88. PMTC Introduction and Business Overview Table 89. PMTC Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 90. PMTC Solder Ball Packaging Material Product Offerings Table 91. PMTC Recent Development Table 92. Shanghai hiking solder material Company Information Table 93. Shanghai hiking solder material Introduction and Business Overview Table 94. Shanghai hiking solder material Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 95. Shanghai hiking solder material Solder Ball Packaging Material Product Offerings Table 96. Shanghai hiking solder material Recent Development Table 97. Shenmao Technology Company Information Table 98. Shenmao Technology Introduction and Business Overview Table 99. Shenmao Technology Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 100. Shenmao Technology Solder Ball Packaging Material Product Offerings Table 101. Shenmao Technology Recent Development Table 102. Indium Corporation Company Information Table 103. Indium Corporation Introduction and Business Overview Table 104. Indium Corporation Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 105. Indium Corporation Solder Ball Packaging Material Product Offerings Table 106. Indium Corporation Recent Development Table 107. Jovy Systems Company Information Table 108. Jovy Systems Introduction and Business Overview Table 109. Jovy Systems Solder Ball Packaging Material Sales (Million Units), Revenue (US$ Million), Price (USD/Million Units) and Gross Margin (2019-2024) Table 110. Jovy Systems Solder Ball Packaging Material Product Offerings Table 111. Jovy Systems Recent Development Table 112. Key Raw Materials Lists Table 113. Raw Materials Key Suppliers Lists Table 114. Solder Ball Packaging Material Downstream Customers Table 115. Solder Ball Packaging Material Distributors List Table 116. Research Programs/Design for This Report Table 117. Key Data Information from Secondary Sources Table 118. Key Data Information from Primary Sources List of Figures Figure 1. Solder Ball Packaging Material Product Picture Figure 2. Global Solder Ball Packaging Material Sales Value, 2019 VS 2023 VS 2030 (US$ Million) Figure 3. Global Solder Ball Packaging Material Sales Value (2019-2030) & (US$ Million) Figure 4. Global Solder Ball Packaging Material Sales Volume (2019-2030) & (Million Units) Figure 5. Global Solder Ball Packaging Material Sales Price (2019-2030) & (USD/Million Units) Figure 6. Solder Ball Packaging Material Report Years Considered Figure 7. Global Solder Ball Packaging Material Players Revenue Ranking (2023) & (US$ Million) Figure 8. Global Solder Ball Packaging Material Players Sales Volume Ranking (2023) & (Million Units) Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Solder Ball Packaging Material Revenue in 2023 Figure 10. Solder Ball Packaging Material Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023 Figure 11. Lead Solder Ball Picture Figure 12. Lead Free Solder Ball Picture Figure 13. Global Solder Ball Packaging Material Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million) Figure 14. Global Solder Ball Packaging Material Sales Value Market Share by Type, 2023 & 2030 Figure 15. Global Solder Ball Packaging Material Sales Volume by Type (2019 VS 2023 VS 2030) & (Million Units) Figure 16. Global Solder Ball Packaging Material Sales Volume Market Share by Type, 2023 & 2030 Figure 17. Global Solder Ball Packaging Material Price by Type (2019-2030) & (USD/Million Units) Figure 18. Product Picture of BGA Figure 19. Product Picture of CSP & WLCSP Figure 20. Product Picture of Flip-Chip & Others Figure 21. Global Solder Ball Packaging Material Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million) Figure 22. Global Solder Ball Packaging Material Sales Value Market Share by Application, 2023 & 2030 Figure 23. Global Solder Ball Packaging Material Sales Volume by Application (2019 VS 2023 VS 2030) & (Million Units) Figure 24. Global Solder Ball Packaging Material Sales Volume Market Share by Application, 2023 & 2030 Figure 25. Global Solder Ball Packaging Material Price by Application (2019-2030) & (USD/Million Units) Figure 26. North America Solder Ball Packaging Material Sales Value (2019-2030) & (US$ Million) Figure 27. North America Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030 Figure 28. Europe Solder Ball Packaging Material Sales Value (2019-2030) & (US$ Million) Figure 29. Europe Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030 Figure 30. Asia Pacific Solder Ball Packaging Material Sales Value (2019-2030) & (US$ Million) Figure 31. Asia Pacific Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030 Figure 32. South America Solder Ball Packaging Material Sales Value (2019-2030) & (US$ Million) Figure 33. South America Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030 Figure 34. Middle East & Africa Solder Ball Packaging Material Sales Value (2019-2030) & (US$ Million) Figure 35. Middle East & Africa Solder Ball Packaging Material Sales Value by Country (%), 2023 VS 2030 Figure 36. Key Countries/Regions Solder Ball Packaging Material Sales Value (%), (2019-2030) Figure 37. Key Countries/Regions Solder Ball Packaging Material Sales Volume (%), (2019-2030) Figure 38. United States Solder Ball Packaging Material Sales Value, (2019-2030) & (US$ Million) Figure 39. United States Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030 Figure 40. United States Solder Ball Packaging Material Sales Value by Application (%), 2023 VS 2030 Figure 41. Europe Solder Ball Packaging Material Sales Value, (2019-2030) & (US$ Million) Figure 42. Europe Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030 Figure 43. Europe Solder Ball Packaging Material Sales Value by Application (%), 2023 VS 2030 Figure 44. China Solder Ball Packaging Material Sales Value, (2019-2030) & (US$ Million) Figure 45. China Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030 Figure 46. China Solder Ball Packaging Material Sales Value by Application (%), 2023 VS 2030 Figure 47. Japan Solder Ball Packaging Material Sales Value, (2019-2030) & (US$ Million) Figure 48. Japan Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030 Figure 49. Japan Solder Ball Packaging Material Sales Value by Application (%), 2023 VS 2030 Figure 50. South Korea Solder Ball Packaging Material Sales Value, (2019-2030) & (US$ Million) Figure 51. South Korea Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030 Figure 52. South Korea Solder Ball Packaging Material Sales Value by Application (%), 2023 VS 2030 Figure 53. Southeast Asia Solder Ball Packaging Material Sales Value, (2019-2030) & (US$ Million) Figure 54. Southeast Asia Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030 Figure 55. Southeast Asia Solder Ball Packaging Material Sales Value by Application (%), 2023 VS 2030 Figure 56. India Solder Ball Packaging Material Sales Value, (2019-2030) & (US$ Million) Figure 57. India Solder Ball Packaging Material Sales Value by Type (%), 2023 VS 2030 Figure 58. India Solder Ball Packaging Material Sales Value by Application (%), 2023 VS 2030 Figure 59. Solder Ball Packaging Material Industrial Chain Figure 60. Solder Ball Packaging Material Manufacturing Cost Structure Figure 61. Channels of Distribution (Direct Sales, and Distribution) Figure 62. Bottom-up and Top-down Approaches for This Report Figure 63. Data Triangulation Figure 64. Key Executives Interviewed
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux. Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The global market for Solder Ball Packaging Material was estimated to be worth US$ 242.3 million in 2023 and is forecast to a readjusted size of US$ 346.5 million by 2030 with a CAGR of 6.5% during the forecast period 2024-2030 Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share. Report Scope This report aims to provide a comprehensive presentation of the global market for Solder Ball Packaging Material, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Solder Ball Packaging Material by region & country, by Type, and by Application. The Solder Ball Packaging Material market size, estimations, and forecasts are provided in terms of sales volume (Million Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Ball Packaging Material. Market Segmentation
Chapter Outline Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. Chapter 2: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc. Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 5: Sales, revenue of Solder Ball Packaging Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world. Chapter 6: Sales, revenue of Solder Ball Packaging Material in country level. It provides sigmate data by Type, and by Application for each country/region. Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry. Chapter 9: Conclusion.
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English
Simon Lee
English
Hitesh
Chinese
Damon
Japanese
Tang Xin
Korean
Sung-Bin Yoon
Competition
Key players, new entrants,acquisitions, mergers and expansions,development trends and challenges.
Industry Analysis
Rawmaterial, application, product type, demand,supply,downstream, supply chain etc.
Market Size
Capacity, production, sales, revenue, price, cost etc.
Customized Information
We can offer customized survey and information to meet ourclient's need.
Fastest report delivery service
More than 17 years of vast experience
Operation for 24 * 7 & 365 days
In-depth and comprehensive analysis
Professional and timely after-sales service
Owns large database
English
Simon Lee
English
Hitesh
Chinese
Damon
Japanese
Tang Xin
Korean
Sung-Bin Yoon
Competition
Key players, new entrants,acquisitions, mergers and expansions,development trends and challenges.
Industry Analysis
Rawmaterial, application, product type, demand,supply,downstream, supply chain etc.
Market Size
Capacity, production, sales, revenue, price, cost etc.
Customized Information
We can offer customized survey and information to meet ourclient's need.
Fastest report delivery service
More than 17 years of vast experience
Operation for 24 * 7 & 365 days
In-depth and comprehensive analysis
Professional and timely after-sales service
Owns large database
Add to Cart
Buy Now