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3D IC & 2.5D IC Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Industry: Electronics & Semiconductor

Published: 2024-01-16

Pages: 117 Pages

Report ld: 2229411

Description
Table of Contents
Table of Figures
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Description
Table of Contents
Table of Figures
PDF Download

Description

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

The global market for 3D IC & 2.5D IC Packaging was estimated to be worth US$ 6954 million in 2023 and is forecast to a readjusted size of US$ 20620 million by 2030 with a CAGR of 16.8% during the forecast period 2024-2030

3D IC & 2.5D IC Packaging Market Size

M= millions and B=billions

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

Report Scope
This report aims to provide a comprehensive presentation of the global market for 3D IC & 2.5D IC Packaging, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of 3D IC & 2.5D IC Packaging by region & country, by Type, and by Application.

The 3D IC & 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC & 2.5D IC Packaging.

Market Segmentation

Report Metric
Details
Report Title
3D IC & 2.5D IC Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Forecasted Market Size in 2030
US$ 20620 million
CAGR(2024-2030)
16.8%
Market Size Available for Years
2019-2030
Global 3D IC & 2.5D IC Packaging Companies Covered
Intel Corporation, Toshiba Corp, Samsung Electronics, Stmicroelectronics, Taiwan Semiconductor Manufacturing, Amkor Technology, United Microelectronics, Broadcom, ASE Group, Pure Storage, Advanced Semiconductor Engineering, JCET, TongFu Microelectronics
Global 3D IC & 2.5D IC Packaging Market, by Region
North America (U.S., Canada, Mexico)

Europe (Germany, France, UK, Italy, etc.)

Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)

South America (Brazil, etc.)

Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 3D IC & 2.5D IC Packaging Market, Segment by Type
3D TSV

2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Global 3D IC & 2.5D IC Packaging Market, Segment by Application
Automotive

Consumer electronics

Medical devices

Military & aerospace

Telecommunication

Industrial sector and smart technologies
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of 3D IC & 2.5D IC Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of 3D IC & 2.5D IC Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of 3D IC & 2.5D IC Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Table of Contents

 1 Market Overview
    1.1 3D IC & 2.5D IC Packaging Product Introduction
    1.2 Global 3D IC & 2.5D IC Packaging Market Size Forecast
        1.2.1 Global 3D IC & 2.5D IC Packaging Sales Value (2019-2030)
        1.2.2 Global 3D IC & 2.5D IC Packaging Sales Volume (2019-2030)
        1.2.3 Global 3D IC & 2.5D IC Packaging Sales Price (2019-2030)
    1.3 3D IC & 2.5D IC Packaging Market Trends & Drivers
        1.3.1 3D IC & 2.5D IC Packaging Industry Trends
        1.3.2 3D IC & 2.5D IC Packaging Market Drivers & Opportunity
        1.3.3 3D IC & 2.5D IC Packaging Market Challenges
        1.3.4 3D IC & 2.5D IC Packaging Market Restraints
    1.4 Assumptions and Limitations
    1.5 Study Objectives
    1.6 Years Considered

 2 Competitive Analysis by Company
    2.1 Global 3D IC & 2.5D IC Packaging Players Revenue Ranking (2023)
    2.2 Global 3D IC & 2.5D IC Packaging Revenue by Company (2019-2024)
    2.3 Global 3D IC & 2.5D IC Packaging Players Sales Volume Ranking (2023)
    2.4 Global 3D IC & 2.5D IC Packaging Sales Volume by Company Players (2019-2024)
    2.5 Global 3D IC & 2.5D IC Packaging Average Price by Company (2019-2024)
    2.6 Key Manufacturers 3D IC & 2.5D IC Packaging Manufacturing Base Distribution and Headquarters
    2.7 Key Manufacturers 3D IC & 2.5D IC Packaging Product Offered
    2.8 Key Manufacturers Time to Begin Mass Production of 3D IC & 2.5D IC Packaging
    2.9 3D IC & 2.5D IC Packaging Market Competitive Analysis
        2.9.1 3D IC & 2.5D IC Packaging Market Concentration Rate (2019-2024)
        2.9.2 Global 5 and 10 Largest Manufacturers by 3D IC & 2.5D IC Packaging Revenue in 2023
        2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D IC & 2.5D IC Packaging as of 2023)
    2.10 Mergers & Acquisitions, Expansion

 3 Segmentation by Type
    3.1 Introduction by Type
        3.1.1 3D TSV
        3.1.2 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    3.2 Global 3D IC & 2.5D IC Packaging Sales Value by Type
        3.2.1 Global 3D IC & 2.5D IC Packaging Sales Value by Type (2019 VS 2023 VS 2030)
        3.2.2 Global 3D IC & 2.5D IC Packaging Sales Value, by Type (2019-2030)
        3.2.3 Global 3D IC & 2.5D IC Packaging Sales Value, by Type (%) (2019-2030)
    3.3 Global 3D IC & 2.5D IC Packaging Sales Volume by Type
        3.3.1 Global 3D IC & 2.5D IC Packaging Sales Volume by Type (2019 VS 2023 VS 2030)
        3.3.2 Global 3D IC & 2.5D IC Packaging Sales Volume, by Type (2019-2030)
        3.3.3 Global 3D IC & 2.5D IC Packaging Sales Volume, by Type (%) (2019-2030)
    3.4 Global 3D IC & 2.5D IC Packaging Average Price by Type (2019-2030)

 4 Segmentation by Application
    4.1 Introduction by Application
        4.1.1 Automotive
        4.1.2 Consumer electronics
        4.1.3 Medical devices
        4.1.4 Military & aerospace
        4.1.5 Telecommunication
        4.1.6 Industrial sector and smart technologies
    4.2 Global 3D IC & 2.5D IC Packaging Sales Value by Application
        4.2.1 Global 3D IC & 2.5D IC Packaging Sales Value by Application (2019 VS 2023 VS 2030)
        4.2.2 Global 3D IC & 2.5D IC Packaging Sales Value, by Application (2019-2030)
        4.2.3 Global 3D IC & 2.5D IC Packaging Sales Value, by Application (%) (2019-2030)
    4.3 Global 3D IC & 2.5D IC Packaging Sales Volume by Application
        4.3.1 Global 3D IC & 2.5D IC Packaging Sales Volume by Application (2019 VS 2023 VS 2030)
        4.3.2 Global 3D IC & 2.5D IC Packaging Sales Volume, by Application (2019-2030)
        4.3.3 Global 3D IC & 2.5D IC Packaging Sales Volume, by Application (%) (2019-2030)
    4.4 Global 3D IC & 2.5D IC Packaging Average Price by Application (2019-2030)

 5 Segmentation by Region
    5.1 Global 3D IC & 2.5D IC Packaging Sales Value by Region
        5.1.1 Global 3D IC & 2.5D IC Packaging Sales Value by Region: 2019 VS 2023 VS 2030
        5.1.2 Global 3D IC & 2.5D IC Packaging Sales Value by Region (2019-2024)
        5.1.3 Global 3D IC & 2.5D IC Packaging Sales Value by Region (2025-2030)
        5.1.4 Global 3D IC & 2.5D IC Packaging Sales Value by Region (%), (2019-2030)
    5.2 Global 3D IC & 2.5D IC Packaging Sales Volume by Region
        5.2.1 Global 3D IC & 2.5D IC Packaging Sales Volume by Region: 2019 VS 2023 VS 2030
        5.2.2 Global 3D IC & 2.5D IC Packaging Sales Volume by Region (2019-2024)
        5.2.3 Global 3D IC & 2.5D IC Packaging Sales Volume by Region (2025-2030)
        5.2.4 Global 3D IC & 2.5D IC Packaging Sales Volume by Region (%), (2019-2030)
    5.3 Global 3D IC & 2.5D IC Packaging Average Price by Region (2019-2030)
    5.4 North America
        5.4.1 North America 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        5.4.2 North America 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.5 Europe
        5.5.1 Europe 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        5.5.2 Europe 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.6 Asia Pacific
        5.6.1 Asia Pacific 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        5.6.2 Asia Pacific 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.7 South America
        5.7.1 South America 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        5.7.2 South America 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.8 Middle East & Africa
        5.8.1 Middle East & Africa 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        5.8.2 Middle East & Africa 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030

 6 Segmentation by Key Countries/Regions
    6.1 Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Value Growth Trends, 2019 VS 2023 VS 2030
    6.2 Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Value
        6.2.1 Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.2.2 Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Volume, 2019-2030
    6.3 United States
        6.3.1 United States 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.3.2 United States 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.3.3 United States 3D IC & 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.4 Europe
        6.4.1 Europe 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.4.2 Europe 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.4.3 Europe 3D IC & 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.5 China
        6.5.1 China 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.5.2 China 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.5.3 China 3D IC & 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.6 Japan
        6.6.1 Japan 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.6.2 Japan 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.6.3 Japan 3D IC & 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.7 South Korea
        6.7.1 South Korea 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.7.2 South Korea 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.7.3 South Korea 3D IC & 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.8 Southeast Asia
        6.8.1 Southeast Asia 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.8.2 Southeast Asia 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.8.3 Southeast Asia 3D IC & 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.9 India
        6.9.1 India 3D IC & 2.5D IC Packaging Sales Value, 2019-2030
        6.9.2 India 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.9.3 India 3D IC & 2.5D IC Packaging Sales Value by Application, 2023 VS 2030

 7 Company Profiles
    7.1 Intel Corporation
        7.1.1 Intel Corporation Company Information
        7.1.2 Intel Corporation Introduction and Business Overview
        7.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.1.4 Intel Corporation 3D IC & 2.5D IC Packaging Product Offerings
        7.1.5 Intel Corporation Recent Development
    7.2 Toshiba Corp
        7.2.1 Toshiba Corp Company Information
        7.2.2 Toshiba Corp Introduction and Business Overview
        7.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.2.4 Toshiba Corp 3D IC & 2.5D IC Packaging Product Offerings
        7.2.5 Toshiba Corp Recent Development
    7.3 Samsung Electronics
        7.3.1 Samsung Electronics Company Information
        7.3.2 Samsung Electronics Introduction and Business Overview
        7.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.3.4 Samsung Electronics 3D IC & 2.5D IC Packaging Product Offerings
        7.3.5 Samsung Electronics Recent Development
    7.4 Stmicroelectronics
        7.4.1 Stmicroelectronics Company Information
        7.4.2 Stmicroelectronics Introduction and Business Overview
        7.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.4.4 Stmicroelectronics 3D IC & 2.5D IC Packaging Product Offerings
        7.4.5 Stmicroelectronics Recent Development
    7.5 Taiwan Semiconductor Manufacturing
        7.5.1 Taiwan Semiconductor Manufacturing Company Information
        7.5.2 Taiwan Semiconductor Manufacturing Introduction and Business Overview
        7.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.5.4 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product Offerings
        7.5.5 Taiwan Semiconductor Manufacturing Recent Development
    7.6 Amkor Technology
        7.6.1 Amkor Technology Company Information
        7.6.2 Amkor Technology Introduction and Business Overview
        7.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.6.4 Amkor Technology 3D IC & 2.5D IC Packaging Product Offerings
        7.6.5 Amkor Technology Recent Development
    7.7 United Microelectronics
        7.7.1 United Microelectronics Company Information
        7.7.2 United Microelectronics Introduction and Business Overview
        7.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.7.4 United Microelectronics 3D IC & 2.5D IC Packaging Product Offerings
        7.7.5 United Microelectronics Recent Development
    7.8 Broadcom
        7.8.1 Broadcom Company Information
        7.8.2 Broadcom Introduction and Business Overview
        7.8.3 Broadcom 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.8.4 Broadcom 3D IC & 2.5D IC Packaging Product Offerings
        7.8.5 Broadcom Recent Development
    7.9 ASE Group
        7.9.1 ASE Group Company Information
        7.9.2 ASE Group Introduction and Business Overview
        7.9.3 ASE Group 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.9.4 ASE Group 3D IC & 2.5D IC Packaging Product Offerings
        7.9.5 ASE Group Recent Development
    7.10 Pure Storage
        7.10.1 Pure Storage Company Information
        7.10.2 Pure Storage Introduction and Business Overview
        7.10.3 Pure Storage 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.10.4 Pure Storage 3D IC & 2.5D IC Packaging Product Offerings
        7.10.5 Pure Storage Recent Development
    7.11 Advanced Semiconductor Engineering
        7.11.1 Advanced Semiconductor Engineering Company Information
        7.11.2 Advanced Semiconductor Engineering Introduction and Business Overview
        7.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.11.4 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product Offerings
        7.11.5 Advanced Semiconductor Engineering Recent Development
    7.12 JCET
        7.12.1 JCET Company Information
        7.12.2 JCET Introduction and Business Overview
        7.12.3 JCET 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.12.4 JCET 3D IC & 2.5D IC Packaging Product Offerings
        7.12.5 JCET Recent Development
    7.13 TongFu Microelectronics
        7.13.1 TongFu Microelectronics Company Information
        7.13.2 TongFu Microelectronics Introduction and Business Overview
        7.13.3 TongFu Microelectronics 3D IC & 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.13.4 TongFu Microelectronics 3D IC & 2.5D IC Packaging Product Offerings
        7.13.5 TongFu Microelectronics Recent Development

 8 Industry Chain Analysis
    8.1 3D IC & 2.5D IC Packaging Industrial Chain
    8.2 3D IC & 2.5D IC Packaging Upstream Analysis
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
        8.2.3 Manufacturing Cost Structure
    8.3 Midstream Analysis
    8.4 Downstream Analysis (Customers Analysis)
    8.5 Sales Model and Sales Channels
        8.5.1 3D IC & 2.5D IC Packaging Sales Model
        8.5.2 Sales Channel
        8.5.3 3D IC & 2.5D IC Packaging Distributors

 9 Research Findings and Conclusion

 10 Appendix
    10.1 Research Methodology
        10.1.1 Methodology/Research Approach
        10.1.2 Data Source
    10.2 Author Details
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. 3D IC & 2.5D IC Packaging Market Trends
    Table 2. 3D IC & 2.5D IC Packaging Market Drivers & Opportunity
    Table 3. 3D IC & 2.5D IC Packaging Market Challenges
    Table 4. 3D IC & 2.5D IC Packaging Market Restraints
    Table 5. Global 3D IC & 2.5D IC Packaging Revenue by Company (2019-2024) & (US$ Million)
    Table 6. Global 3D IC & 2.5D IC Packaging Revenue Market Share by Company (2019-2024)
    Table 7. Global 3D IC & 2.5D IC Packaging Sales Volume by Company (2019-2024) & (K Units)
    Table 8. Global 3D IC & 2.5D IC Packaging Sales Volume Market Share by Company (2019-2024)
    Table 9. Global Market 3D IC & 2.5D IC Packaging Price by Company (2019-2024) & (USD/Unit)
    Table 10. Key Manufacturers 3D IC & 2.5D IC Packaging Manufacturing Base Distribution and Headquarters
    Table 11. Key Manufacturers 3D IC & 2.5D IC Packaging Product Type
    Table 12. Key Manufacturers Time to Begin Mass Production of 3D IC & 2.5D IC Packaging
    Table 13. Global 3D IC & 2.5D IC Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D IC & 2.5D IC Packaging as of 2023)
    Table 15. Mergers & Acquisitions, Expansion Plans
    Table 16. Global 3D IC & 2.5D IC Packaging Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
    Table 17. Global 3D IC & 2.5D IC Packaging Sales Value by Type (2019-2024) & (US$ Million)
    Table 18. Global 3D IC & 2.5D IC Packaging Sales Value by Type (2025-2030) & (US$ Million)
    Table 19. Global 3D IC & 2.5D IC Packaging Sales Market Share in Value by Type (2019-2024) & (%)
    Table 20. Global 3D IC & 2.5D IC Packaging Sales Market Share in Value by Type (2025-2030) & (%)
    Table 21. Global 3D IC & 2.5D IC Packaging Sales Volume by Type: 2019 VS 2023 VS 2030 (K Units)
    Table 22. Global 3D IC & 2.5D IC Packaging Sales Volume by Type (2019-2024) & (K Units)
    Table 23. Global 3D IC & 2.5D IC Packaging Sales Volume by Type (2025-2030) & (K Units)
    Table 24. Global 3D IC & 2.5D IC Packaging Sales Market Share in Volume by Type (2019-2024) & (%)
    Table 25. Global 3D IC & 2.5D IC Packaging Sales Market Share in Volume by Type (2025-2030) & (%)
    Table 26. Global 3D IC & 2.5D IC Packaging Price by Type (2019-2024) & (USD/Unit)
    Table 27. Global 3D IC & 2.5D IC Packaging Price by Type (2025-2030) & (USD/Unit)
    Table 28. Global 3D IC & 2.5D IC Packaging Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)
    Table 29. Global 3D IC & 2.5D IC Packaging Sales Value by Application (2019-2024) & (US$ Million)
    Table 30. Global 3D IC & 2.5D IC Packaging Sales Value by Application (2025-2030) & (US$ Million)
    Table 31. Global 3D IC & 2.5D IC Packaging Sales Market Share in Value by Application (2019-2024) & (%)
    Table 32. Global 3D IC & 2.5D IC Packaging Sales Market Share in Value by Application (2025-2030) & (%)
    Table 33. Global 3D IC & 2.5D IC Packaging Sales Volume by Application: 2019 VS 2023 VS 2030 (K Units)
    Table 34. Global 3D IC & 2.5D IC Packaging Sales Volume by Application (2019-2024) & (K Units)
    Table 35. Global 3D IC & 2.5D IC Packaging Sales Volume by Application (2025-2030) & (K Units)
    Table 36. Global 3D IC & 2.5D IC Packaging Sales Market Share in Volume by Application (2019-2024) & (%)
    Table 37. Global 3D IC & 2.5D IC Packaging Sales Market Share in Volume by Application (2025-2030) & (%)
    Table 38. Global 3D IC & 2.5D IC Packaging Price by Application (2019-2024) & (USD/Unit)
    Table 39. Global 3D IC & 2.5D IC Packaging Price by Application (2025-2030) & (USD/Unit)
    Table 40. Global 3D IC & 2.5D IC Packaging Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 41. Global 3D IC & 2.5D IC Packaging Sales Value by Region (2019-2024) & (US$ Million)
    Table 42. Global 3D IC & 2.5D IC Packaging Sales Value by Region (2025-2030) & (US$ Million)
    Table 43. Global 3D IC & 2.5D IC Packaging Sales Value by Region (2019-2024) & (%)
    Table 44. Global 3D IC & 2.5D IC Packaging Sales Value by Region (2025-2030) & (%)
    Table 45. Global 3D IC & 2.5D IC Packaging Sales Volume by Region (K Units): 2019 VS 2023 VS 2030
    Table 46. Global 3D IC & 2.5D IC Packaging Sales Volume by Region (2019-2024) & (K Units)
    Table 47. Global 3D IC & 2.5D IC Packaging Sales Volume by Region (2025-2030) & (K Units)
    Table 48. Global 3D IC & 2.5D IC Packaging Sales Volume by Region (2019-2024) & (%)
    Table 49. Global 3D IC & 2.5D IC Packaging Sales Volume by Region (2025-2030) & (%)
    Table 50. Global 3D IC & 2.5D IC Packaging Average Price by Region (2019-2024) & (USD/Unit)
    Table 51. Global 3D IC & 2.5D IC Packaging Average Price by Region (2025-2030) & (USD/Unit)
    Table 52. Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
    Table 53. Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Value, (2019-2024) & (US$ Million)
    Table 54. Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Value, (2025-2030) & (US$ Million)
    Table 55. Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Volume, (2019-2024) & (K Units)
    Table 56. Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Volume, (2025-2030) & (K Units)
    Table 57. Intel Corporation Company Information
    Table 58. Intel Corporation Introduction and Business Overview
    Table 59. Intel Corporation 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 60. Intel Corporation 3D IC & 2.5D IC Packaging Product Offerings
    Table 61. Intel Corporation Recent Development
    Table 62. Toshiba Corp Company Information
    Table 63. Toshiba Corp Introduction and Business Overview
    Table 64. Toshiba Corp 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 65. Toshiba Corp 3D IC & 2.5D IC Packaging Product Offerings
    Table 66. Toshiba Corp Recent Development
    Table 67. Samsung Electronics Company Information
    Table 68. Samsung Electronics Introduction and Business Overview
    Table 69. Samsung Electronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 70. Samsung Electronics 3D IC & 2.5D IC Packaging Product Offerings
    Table 71. Samsung Electronics Recent Development
    Table 72. Stmicroelectronics Company Information
    Table 73. Stmicroelectronics Introduction and Business Overview
    Table 74. Stmicroelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 75. Stmicroelectronics 3D IC & 2.5D IC Packaging Product Offerings
    Table 76. Stmicroelectronics Recent Development
    Table 77. Taiwan Semiconductor Manufacturing Company Information
    Table 78. Taiwan Semiconductor Manufacturing Introduction and Business Overview
    Table 79. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 80. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product Offerings
    Table 81. Taiwan Semiconductor Manufacturing Recent Development
    Table 82. Amkor Technology Company Information
    Table 83. Amkor Technology Introduction and Business Overview
    Table 84. Amkor Technology 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 85. Amkor Technology 3D IC & 2.5D IC Packaging Product Offerings
    Table 86. Amkor Technology Recent Development
    Table 87. United Microelectronics Company Information
    Table 88. United Microelectronics Introduction and Business Overview
    Table 89. United Microelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 90. United Microelectronics 3D IC & 2.5D IC Packaging Product Offerings
    Table 91. United Microelectronics Recent Development
    Table 92. Broadcom Company Information
    Table 93. Broadcom Introduction and Business Overview
    Table 94. Broadcom 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 95. Broadcom 3D IC & 2.5D IC Packaging Product Offerings
    Table 96. Broadcom Recent Development
    Table 97. ASE Group Company Information
    Table 98. ASE Group Introduction and Business Overview
    Table 99. ASE Group 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 100. ASE Group 3D IC & 2.5D IC Packaging Product Offerings
    Table 101. ASE Group Recent Development
    Table 102. Pure Storage Company Information
    Table 103. Pure Storage Introduction and Business Overview
    Table 104. Pure Storage 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 105. Pure Storage 3D IC & 2.5D IC Packaging Product Offerings
    Table 106. Pure Storage Recent Development
    Table 107. Advanced Semiconductor Engineering Company Information
    Table 108. Advanced Semiconductor Engineering Introduction and Business Overview
    Table 109. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 110. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product Offerings
    Table 111. Advanced Semiconductor Engineering Recent Development
    Table 112. JCET Company Information
    Table 113. JCET Introduction and Business Overview
    Table 114. JCET 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 115. JCET 3D IC & 2.5D IC Packaging Product Offerings
    Table 116. JCET Recent Development
    Table 117. TongFu Microelectronics Company Information
    Table 118. TongFu Microelectronics Introduction and Business Overview
    Table 119. TongFu Microelectronics 3D IC & 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)
    Table 120. TongFu Microelectronics 3D IC & 2.5D IC Packaging Product Offerings
    Table 121. TongFu Microelectronics Recent Development
    Table 122. Key Raw Materials Lists
    Table 123. Raw Materials Key Suppliers Lists
    Table 124. 3D IC & 2.5D IC Packaging Downstream Customers
    Table 125. 3D IC & 2.5D IC Packaging Distributors List
    Table 126. Research Programs/Design for This Report
    Table 127. Key Data Information from Secondary Sources
    Table 128. Key Data Information from Primary Sources
List of Figures
    Figure 1. 3D IC & 2.5D IC Packaging Product Picture
    Figure 2. Global 3D IC & 2.5D IC Packaging Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 3. Global 3D IC & 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 4. Global 3D IC & 2.5D IC Packaging Sales Volume (2019-2030) & (K Units)
    Figure 5. Global 3D IC & 2.5D IC Packaging Sales Price (2019-2030) & (USD/Unit)
    Figure 6. 3D IC & 2.5D IC Packaging Report Years Considered
    Figure 7. Global 3D IC & 2.5D IC Packaging Players Revenue Ranking (2023) & (US$ Million)
    Figure 8. Global 3D IC & 2.5D IC Packaging Players Sales Volume Ranking (2023) & (K Units)
    Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by 3D IC & 2.5D IC Packaging Revenue in 2023
    Figure 10. 3D IC & 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
    Figure 11. 3D TSV Picture
    Figure 12. 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Picture
    Figure 13. Global 3D IC & 2.5D IC Packaging Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 14. Global 3D IC & 2.5D IC Packaging Sales Value Market Share by Type, 2023 & 2030
    Figure 15. Global 3D IC & 2.5D IC Packaging Sales Volume by Type (2019 VS 2023 VS 2030) & (K Units)
    Figure 16. Global 3D IC & 2.5D IC Packaging Sales Volume Market Share by Type, 2023 & 2030
    Figure 17. Global 3D IC & 2.5D IC Packaging Price by Type (2019-2030) & (USD/Unit)
    Figure 18. Product Picture of Automotive
    Figure 19. Product Picture of Consumer electronics
    Figure 20. Product Picture of Medical devices
    Figure 21. Product Picture of Military & aerospace
    Figure 22. Product Picture of Telecommunication
    Figure 23. Product Picture of Industrial sector and smart technologies
    Figure 24. Global 3D IC & 2.5D IC Packaging Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 25. Global 3D IC & 2.5D IC Packaging Sales Value Market Share by Application, 2023 & 2030
    Figure 26. Global 3D IC & 2.5D IC Packaging Sales Volume by Application (2019 VS 2023 VS 2030) & (K Units)
    Figure 27. Global 3D IC & 2.5D IC Packaging Sales Volume Market Share by Application, 2023 & 2030
    Figure 28. Global 3D IC & 2.5D IC Packaging Price by Application (2019-2030) & (USD/Unit)
    Figure 29. North America 3D IC & 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 30. North America 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 31. Europe 3D IC & 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 32. Europe 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 33. Asia Pacific 3D IC & 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 34. Asia Pacific 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 35. South America 3D IC & 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 36. South America 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 37. Middle East & Africa 3D IC & 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 38. Middle East & Africa 3D IC & 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 39. Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Value (%), (2019-2030)
    Figure 40. Key Countries/Regions 3D IC & 2.5D IC Packaging Sales Volume (%), (2019-2030)
    Figure 41. United States 3D IC & 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 42. United States 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 43. United States 3D IC & 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 44. Europe 3D IC & 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 45. Europe 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 46. Europe 3D IC & 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 47. China 3D IC & 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 48. China 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 49. China 3D IC & 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 50. Japan 3D IC & 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 51. Japan 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 52. Japan 3D IC & 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 53. South Korea 3D IC & 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 54. South Korea 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 55. South Korea 3D IC & 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 56. Southeast Asia 3D IC & 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 57. Southeast Asia 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 58. Southeast Asia 3D IC & 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 59. India 3D IC & 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 60. India 3D IC & 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 61. India 3D IC & 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 62. 3D IC & 2.5D IC Packaging Industrial Chain
    Figure 63. 3D IC & 2.5D IC Packaging Manufacturing Cost Structure
    Figure 64. Channels of Distribution (Direct Sales, and Distribution)
    Figure 65. Bottom-up and Top-down Approaches for This Report
    Figure 66. Data Triangulation
    Figure 67. Key Executives Interviewed

Description

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

The global market for 3D IC & 2.5D IC Packaging was estimated to be worth US$ 6954 million in 2023 and is forecast to a readjusted size of US$ 20620 million by 2030 with a CAGR of 16.8% during the forecast period 2024-2030

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

Report Scope
This report aims to provide a comprehensive presentation of the global market for 3D IC & 2.5D IC Packaging, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of 3D IC & 2.5D IC Packaging by region & country, by Type, and by Application.

The 3D IC & 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC & 2.5D IC Packaging.

Market Segmentation