Reports

QYR in News

Hunan Jinling Machine Tool Technology Company cites a report on the Wafer Grinding and Polishing Machine market published by Hengzhou Bozhi

241119-155735.png (480 KB)


At the same time, the global wafer grinding and polishing machine market also shows a solid expansion trend, according to market research organization QYR (Hengzhou Bozhi) of the latest statistics reveal that by 2023, the market size has expanded to about 4.503 billion U.S. dollars.


Source: Machine Tool Business

More: https: //www.jc35.com/company_news/detail/119424.html

Have a question?
Simon Lee

English

English
Hitesh

English

English
Damon

Chinese

Chinese
Tang Xin

Japanese

Japanese
Sung-Bin Yoon

Korean

Korean

Sung-Bin Yoon

+82-2883 1278

WHAT QYRESEARCH OFFER?
Competition

Competition

Key players, new entrants,acquisitions, mergers and expansions,development trends and challenges.

Industry Analysis

Industry Analysis

Rawmaterial, application, product type, demand,supply,downstream, supply chain etc.

Market Size

Market Size

Capacity, production, sales, revenue, price, cost etc.

Customized Information

Customized Information

We can offer customized survey and information to meet ourclient's need.