Sintering Paste Industry Analysis：the global market size is projected to reach USD 0.29 billion by 2030

Sintering Paste is a special paste material that is usually used to connect and fix metal powders during high-temperature sintering. Under high temperature conditions, metal powder particles contact each other and sinter under the action of heat energy to form a dense metal connection. During the sintering process, this paste material melts at high temperature, fills the gaps between particles, and forms a strong connection. After sintering, the material cools and solidifies to form a dense metal part.

According to the new market research report “Sintering Paste - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Sintering Paste market size is projected to reach USD 0.29 billion by 2030, at a CAGR of 6.8% during the forecast period.

• Global Sintering Paste MarketSize(US$ Million), 2019-2030

Source: QYResearch, "Sintering Paste - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

• Global Sintering Paste Top25Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)

Source: QYResearch, "Sintering Paste - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

According to QYResearch Top Players Research Center, the global key manufacturers of Sintering Paste include Heraeus Electronics, Kyocera, Indium, Alpha Assembly Solutions, Henkel, Namics, Advanced Joining Technology, Shenzhen Facemoore, Beijing Nanotop, TANAKA Precious Metals, etc. In 2023, the global top 10 players had a share approximately 89.0% in terms of revenue.

Power Semiconductor Devices refer to electronic devices with individual functions and functions that cannot be disassembled. According to different chip structures and functions, they can be divided into diodes, triodes, bridge rectifiers, thyristors, etc., and can be divided from the perspective of power dissipation (or rated current) For small signal devices, power devices.

The power amplifiers in 5G mobile phones and 5G base stations are key components of RF modules. Silver Sintering Paste is widely used in power amplifier chip packaging for 5G mobile phones and 5G base stations.

Various technical routes of Mini LED are advancing by leaps and bounds, the small-pitch market continues to explode, commercial display applications are in the ascendant, 5G, 8K, AI technology empowerment, etc. all bring new opportunities for the development of the LED industry.

In terms of product application, currently Power Semiconductor Device is the largest segment, hold a share of 57.2%.

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