Gold Bump Flip Chips Industry Analysis：the global market size is projected to reach USD 2.67 billion by 2029

The English name of flip chip is Flip Chip. It is a pinless structure and generally contains circuit units. Flip-chip chips have a variety of designs. From the perspective of bump materials, they mainly include: gold bumps, tin-lead bumps, copper bumps, etc. Gold bump manufacturing is a manufacturing technology that uses gold bump bonding instead of wire bonding to achieve electrical interconnection between chips and substrates. At present, the driver chip packaging of LCD screens mainly uses gold bump manufacturing technology. Gold bump manufacturing technology uses gold as the bump material, which has excellent electrical conductivity, machinability and heat dissipation performance. The packaged display driver chip has high I/O port density, low induction, good heat dissipation ability and uniform current display. It has outstanding advantages such as good performance, small crosstalk between chip output current channels, and high reliability. Gold bump sealing and testing products are mainly used in display driver chips, as well as CMOS image sensors (CIS), fingerprint sensors (Finger Print Sensor), radio frequency identification chips (RFID), magnetic sensors (Magnetic Sensor), memory (Memory), biometrics Medical devices and other fields.

The statistical scope of this report mainly includes packaging and testing companies with gold bump manufacturing technology, excluding packaging and testing companies such as Samsung and LG that do not provide services to external chip design companies within the system.

According to the new market research report “Gold Bump Flip Chip - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Gold Bump Flip Chips market size is projected to reach USD 2.67 billion by 2029, at a CAGR of 7.9% during the forecast period.

• Global Gold Bump Flip Chips MarketSize(US$ Million), 2018-2029

 

Source: QYResearch, "Gold Bump Flip Chip - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

 

 

 

• Global Gold Bump Flip Chips Top6Players Ranking and Market Share（Continually updated）

 

Source: QYResearch, "Gold Bump Flip Chip - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

 

According to QYResearch Top Players Research Center, the global key manufacturers of Gold Bump Flip Chips include Chipbond Technology, ChipMOS, etc.

In 2022, the global top three players had a share approximately 76.0% in terms of revenue.

Market Drivers:

Technological Innovation: Continuous innovation in new flip-chip manufacturing technologies and processes drives the development of the entire industry. Advances in technology can improve chip performance, reduce costs, and drive market demand.

Increased demand for electronic devices: With the popularity of various electronic devices, such as smartphones, tablets, IoT devices, etc., the demand for flip-chips is also increasing, driving the development of the industry.

Semiconductor industry development: Gold bump flip chip is a part of the semiconductor industry, and the overall development of the semiconductor industry has an important impact on the flip chip industry. Market semiconductor demand and trends will affect flip chip market size

Restraint:

Technical difficulties: Flip chip manufacturing may face some technical challenges, such as process accuracy, material selection, etc. Technical difficulties can lead to production inefficiencies, affecting product quality and performance.

Cost Pressure: Manufacturing flip-chips can involve high equipment and material costs. Cost pressure can become a challenge for manufacturers, especially in a highly competitive market environment.

Supply chain instability: Flip chip manufacturing can rely on complex global supply chains. Supply chain instability, such as raw material supply issues, transportation difficulties, etc., may have a negative impact on the industry.

Opportunity:

Driven by emerging technologies: With the continuous emergence of emerging technologies, such as 5G, artificial intelligence, Internet of Things, etc., the demand for high-performance and high-density chips continues to increase, providing broad market opportunities for gold bump flip-chips.

Intelligent equipment trend: The popularity of intelligent equipment such as smartphones, smart wearable devices, and smart homes has put forward higher requirements for small, lightweight, and high-performance flip-chips, which has brought opportunities to the industry.

Electric vehicles and new energy industry: The development of emerging industries such as electric vehicles and renewable energy has put forward higher requirements for power modules and power systems. Gold bump flip-chips are expected to play an important role in these fields.

Medical electronics market growth: The growth of the medical electronics equipment market, such as medical diagnostic equipment, wearable medical equipment, etc., provides opportunities for high-performance, high-reliability flip-chips.

 

 

About The Authors

	Ziyi Fan
	Lead Author
	Consumer Goods, Equipment & Parts, Packaging, etc.

 

About QYResearch

QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 16 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.

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